公开(公告)号：US3837074A

公开(公告)日：1974-09-24

申请号：US5615970

申请日：1970-07-08

Applicant: BUNKER RAMO

Inventor： GRIFF W

IPC: H01B11/18 ,  H01R9/00 ,  H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/44 ,  H01B13/00 ,  H05K3/00

CPC classification number: H05K1/0221 ,  H01B11/18 ,  H01R9/00 ,  H05K3/06 ,  H05K3/107 ,  H05K3/445 ,  H05K2201/09809 ,  H05K2201/09881 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/1476 ,  Y10T29/49123

Abstract: A structure and fabrication method therefor for supporting and interconnecting electrical circuit components. The structure defines electrically conductive paths between and electrically isolated from conductive planar members by embedment in an elastomeric dielectric comprising a preblended mixture of a thermosetting resin such as an epoxy and not more than 20 percent by weight of a thermoplastic resin such as a polyamide. The structure is fabricated by removing material from a conductive planar member to form a recess extending into said planar member, placing a sheet of said dielectric adjacent the recessed surface and filling said recess with said dielectric by applying heat and pressure to said sheet.

Abstract translation: 一种用于支撑和互连电路元件的结构及其制造方法。 该结构在导电平面构件之间限定导电路径，并且通过嵌入弹性体电介质中而与导电平面构件电绝缘，该弹性体电介质包括热固性树脂如环氧树脂和不超过20重量％的热塑性树脂如聚酰胺的预混合混合物。 通过从导电平面构件去除材料以形成延伸到所述平面构件中的凹槽来制造结构，将所述电介质的片材放置在凹陷表面附近，并通过向所述片材施加热和压力而用所述电介质填充所述凹部。

公开(公告)号：CA936285A

公开(公告)日：1973-10-30

申请号：CA110046

申请日：1971-04-08

Applicant: BUNKER RAMO

Inventor： GRIFF W ,  PATERSON P

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/44

公开(公告)号：ZA717709B

公开(公告)日：1972-08-30

申请号：ZA717709

申请日：1971-11-16

Applicant: BUNKER RAMO

Inventor： GRIFF W ,  JACKSON C ,  PATERSON P

IPC: H01L21/60 ,  H01L23/538 ,  H05K3/10 ,  H05K3/44 ,  H02J

公开(公告)号：ZA7107709B

公开(公告)日：1972-08-30

申请号：ZA7107709

申请日：1971-11-16

Applicant: BUNKER RAMO

Inventor： GRIFF W ,  JACKSON C ,  PATERSON P

IPC: H01L21/60 ,  H01L23/538 ,  H05K3/10 ,  H05K3/44 ,  H02J

CPC classification number: H05K3/445 ,  H01L23/5385 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/107 ,  H05K2201/09745 ,  H05K2201/09881 ,  H05K2203/0323 ,  H05K2203/0369

公开(公告)号：ZA7102165B

公开(公告)日：1971-12-29

申请号：ZA7102165

申请日：1971-04-05

Applicant: BUNKER RAMO

Inventor： GRIFF W ,  PATERSON P

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/44 ,  H03H

CPC classification number: H05K1/0221 ,  H05K3/06 ,  H05K3/107 ,  H05K3/445 ,  H05K2201/09745 ,  H05K2201/09809 ,  H05K2201/09881 ,  H05K2203/0323 ,  H05K2203/0369

公开(公告)号：CA927011A

公开(公告)日：1973-05-22

申请号：CA57913

申请日：1969-07-24

Applicant: BUNKER RAMO

Inventor： GRIFF W

IPC: H01P3/06 ,  H01B11/18 ,  H01B13/016 ,  H01R4/00 ,  H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/44 ,  H05K3/46

公开(公告)号：ZA712165B

公开(公告)日：1971-12-29

申请号：ZA712165

申请日：1971-04-05

Applicant: BUNKER RAMO

Inventor： GRIFF W ,  PATERSON P

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/44 ,  H03H