公开(公告)号：WO2010072163A1

公开(公告)日：2010-07-01

申请号：PCT/CN2009/075990

申请日：2009-12-24

Applicant: BYD COMPANY LIMITED ,  CAO, Duanjian ,  LIU, Junfeng ,  LUO, Wenhai

Inventor： CAO, Duanjian ,  LIU, Junfeng ,  LUO, Wenhai

IPC: B29C45/14 ,  B29C45/16 ,  B29C59/00 ,  B29C39/02 ,  C08F220/10

CPC classification number: B29C37/0053 ,  B29C45/1418 ,  B29C45/14688 ,  B29C45/14754 ,  B29C45/14827 ,  B29C45/372 ,  B29C2045/1477

Abstract: A method of forming a shell of an electrical device comprises the steps of: providing a sheet with a photocured adhesive coating (103) formed on a side thereof, the coating (103) forming a predetermined pattern (101), conforming the sheet with the photo-cured coating (103) to at least a part of an outer configuration of the shell; injecting base material into an injection mold for forming the shell while placing the sheet inside the injection mold ,with the side on which the photocured coating (103) is formed facing toward a cavity of the injection mold; and removing the sheet and the adhered coating from the shell. With the method of the present invention, it is easy to manufacture a well decorated shell of an electrical device with universal adaptability.

Abstract translation: 形成电气装置壳体的方法包括以下步骤：为片材提供形成在其一侧上的光固化粘合剂涂层（103），所述涂层（103）形成预定图案（101），使片材与 光固化涂层（103）至壳体的外部构型的至少一部分; 将基材注入用于形成壳体的注射模具中，同时将片材放置在注射模具内，其中形成光固化涂层（103）的侧面朝向注射模具的空腔; 并从壳体上去除该片材和粘附的涂层。 利用本发明的方法，可以容易地制造具有通用适应性的电气装置的装饰良好的外壳。

公开(公告)号：WO2011012064A1

公开(公告)日：2011-02-03

申请号：PCT/CN2010/075464

申请日：2010-07-26

Applicant: BYD COMPANY LIMITED ,  XIAO, Heng ,  LIU, Junfeng ,  LUO, Wenhai

Inventor： XIAO, Heng ,  LIU, Junfeng ,  LUO, Wenhai

IPC: H01H13/705

CPC classification number: H01H13/88 ,  H01H13/705 ,  H01H13/83 ,  H01H2009/187 ,  H01H2209/002 ,  H01H2219/028 ,  H01H2219/054 ,  H01H2219/056 ,  H01H2227/002 ,  H01H2227/004 ,  H01H2227/01 ,  H01H2227/036 ,  H01H2229/058 ,  H01H2239/068

Abstract: A key (7) comprises a light transmitting key base, a three-dimensional cured resin layer (3) disposed on a lower surface of the base, and a pattern layer (5) disposed on a lower surface of the three-dimensional cured resin layer.The three-dimensional cured resin layer may be formed with a microstructure (6) on a lower surface facing the upper surface of the pattern layer Further, a key board comprising the key is also provided.

Abstract translation: 钥匙（7）包括透光钥匙座，设置在基座的下表面上的三维固化树脂层（3）和设置在三维固化树脂的下表面上的图案层（5） 三维固化树脂层可以在与图案层的上表面相对的下表面上形成有微结构（6）。此外，还提供了包括该键的键板。

公开(公告)号：EP2260129A1

公开(公告)日：2010-12-15

申请号：EP08715127.0

申请日：2008-02-29

Applicant: BYD Company Limited

Inventor： CHENG, Tangli ,  HE, Long ,  JIANG, Zhanfeng ,  TIAN, Ye ,  LIU, Junfeng

IPC: C30B29/22 ,  H01M4/58 ,  H01M4/48 ,  C01B25/45

CPC classification number: C01B25/45 ,  C01G23/002 ,  C01G25/006 ,  C01G31/006 ,  C01G33/006 ,  C01G45/1221 ,  C01G49/009 ,  C01G51/44 ,  C01G53/44 ,  C01P2002/72 ,  C01P2006/40 ,  H01M4/136 ,  H01M4/364 ,  H01M4/5825 ,  H01M4/625 ,  H01M10/052

Abstract: Described is a composite lithium compound having a mixed crystalline structure. Such compound was formed by heating a lithium compound and a metal compound together. The resulting mixed metal crystal exhibits superior electrical property and is a better cathode material for lithium secondary batteries.

公开(公告)号：EP2460169A1

公开(公告)日：2012-06-06

申请号：EP10803897.7

申请日：2010-07-26

Applicant: BYD Company Limited

Inventor： XIAO, Heng ,  LIU, Junfeng ,  LUO, Wenhai

IPC: H01H13/705

CPC classification number: H01H13/88 ,  H01H13/705 ,  H01H13/83 ,  H01H2009/187 ,  H01H2209/002 ,  H01H2219/028 ,  H01H2219/054 ,  H01H2219/056 ,  H01H2227/002 ,  H01H2227/004 ,  H01H2227/01 ,  H01H2227/036 ,  H01H2229/058 ,  H01H2239/068

Abstract: A key (7) comprises a light transmitting key base, a three-dimensional cured resin layer (3) disposed on a lower surface of the base, and a pattern layer (5) disposed on a lower surface of the three-dimensional cured resin layer.The three-dimensional cured resin layer may be formed with a microstructure (6) on a lower surface facing the upper surface of the pattern layer Further, a key board comprising the key is also provided.

公开(公告)号：EP2370242A1

公开(公告)日：2011-10-05

申请号：EP09834116.7

申请日：2009-12-24

Applicant: BYD Company Limited

Inventor： CAO, Duanjian ,  LIU, Junfeng ,  LUO, Wenhai

IPC: B29C45/14 ,  B29C45/16 ,  B29C59/00 ,  B29C39/02 ,  C08F220/10

CPC classification number: B29C37/0053 ,  B29C45/1418 ,  B29C45/14688 ,  B29C45/14754 ,  B29C45/14827 ,  B29C45/372 ,  B29C2045/1477

Abstract: A method of forming a shell of an electrical device comprises the steps of: providing a sheet with a photocured adhesive coating (103) formed on a side thereof, the coating (103) forming a predetermined pattern (101), conforming the sheet with the photo-cured coating (103) to at least a part of an outer configuration of the shell; injecting base material into an injection mold for forming the shell while placing the sheet inside the injection mold ,with the side on which the photocured coating (103) is formed facing toward a cavity of the injection mold; and removing the sheet and the adhered coating from the shell. With the method of the present invention, it is easy to manufacture a well decorated shell of an electrical device with universal adaptability.