公开(公告)号：WO2011012064A1

公开(公告)日：2011-02-03

申请号：PCT/CN2010/075464

申请日：2010-07-26

Applicant: BYD COMPANY LIMITED ,  XIAO, Heng ,  LIU, Junfeng ,  LUO, Wenhai

Inventor： XIAO, Heng ,  LIU, Junfeng ,  LUO, Wenhai

IPC: H01H13/705

CPC classification number: H01H13/88 ,  H01H13/705 ,  H01H13/83 ,  H01H2009/187 ,  H01H2209/002 ,  H01H2219/028 ,  H01H2219/054 ,  H01H2219/056 ,  H01H2227/002 ,  H01H2227/004 ,  H01H2227/01 ,  H01H2227/036 ,  H01H2229/058 ,  H01H2239/068

Abstract: A key (7) comprises a light transmitting key base, a three-dimensional cured resin layer (3) disposed on a lower surface of the base, and a pattern layer (5) disposed on a lower surface of the three-dimensional cured resin layer.The three-dimensional cured resin layer may be formed with a microstructure (6) on a lower surface facing the upper surface of the pattern layer Further, a key board comprising the key is also provided.

Abstract translation: 钥匙（7）包括透光钥匙座，设置在基座的下表面上的三维固化树脂层（3）和设置在三维固化树脂的下表面上的图案层（5） 三维固化树脂层可以在与图案层的上表面相对的下表面上形成有微结构（6）。此外，还提供了包括该键的键板。

公开(公告)号：EP2460169A1

公开(公告)日：2012-06-06

申请号：EP10803897.7

申请日：2010-07-26

Applicant: BYD Company Limited

Inventor： XIAO, Heng ,  LIU, Junfeng ,  LUO, Wenhai

IPC: H01H13/705

CPC classification number: H01H13/88 ,  H01H13/705 ,  H01H13/83 ,  H01H2009/187 ,  H01H2209/002 ,  H01H2219/028 ,  H01H2219/054 ,  H01H2219/056 ,  H01H2227/002 ,  H01H2227/004 ,  H01H2227/01 ,  H01H2227/036 ,  H01H2229/058 ,  H01H2239/068

Abstract: A key (7) comprises a light transmitting key base, a three-dimensional cured resin layer (3) disposed on a lower surface of the base, and a pattern layer (5) disposed on a lower surface of the three-dimensional cured resin layer.The three-dimensional cured resin layer may be formed with a microstructure (6) on a lower surface facing the upper surface of the pattern layer Further, a key board comprising the key is also provided.