公开(公告)号：US20180190897A1

公开(公告)日：2018-07-05

申请号：US15859666

申请日：2018-01-01

Applicant: Broadsens Corp.

Inventor： Chang Zhang ,  Shuangwen Liu ,  Lei Liu

IPC: H01L41/113 ,  H01L41/047 ,  H01L41/053 ,  H01L41/187 ,  H05K1/03 ,  H05K1/18 ,  G01H11/08

CPC classification number: H01L41/1132 ,  B06B1/0651 ,  G01H11/08 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/187 ,  H05K1/0393 ,  H05K1/181 ,  H05K2201/05

Abstract: The present invention discloses a mechanically strengthened piezoelectric sensor for Structural Health Monitoring applications. The sensor includes a two-sided piezo ceramic component, a sensor encapsulation, and at least two wires. The sensor encapsulation has an indented side that forms a recessed area. The recessed area has a supporting structure. The two-sided piezo ceramic component is mounted into the recessed area of the encapsulation and is supported by the supporting structure with the side facing outwards slightly lower than the upper edge of the recessed area. The supporting structure of the encapsulation provides mechanical strength to the piezo ceramic component. The wires are attached to the electrodes of the piezo ceramic component and extend out of the encapsulation. Alternatively, the mechanically strengthened piezoelectric sensor may further include a Printed Circuit Board (PCB). The piezo ceramic component is mounted on the PCB. Then, the PCB is mounted into the recessed area of the encapsulation and is supported by the supporting structure with the side facing outwards slightly lower than the upper edge of the encapsulation.