公开(公告)号：AU6533598A

公开(公告)日：1998-08-18

申请号：AU6533598

申请日：1998-01-23

Applicant: CALIFORNIA INST OF TECHN

Inventor： TAI YU-CHONG ,  FUKANG JIANG ,  CHIHMING HO

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H01L21/301 ,  B32B3/00

Abstract: A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1-100 mum thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10-500 mum) by Si wet etching and then patterned from the back side by reactive ion etching (RIE).