公开(公告)号：WO2007120762A3

公开(公告)日：2008-07-17

申请号：PCT/US2007009023

申请日：2007-04-12

Applicant: CAMBRIOS TECHNOLOGIES CORP ,  ALLEMAND PIERRE-MARC ,  HEIDECKER MANFRED ,  KNAPP MICHAEL R ,  NIKIFOROV THEO ,  WANG CHENG-I

Inventor： ALLEMAND PIERRE-MARC ,  HEIDECKER MANFRED ,  KNAPP MICHAEL R ,  NIKIFOROV THEO ,  WANG CHENG-I

IPC: G01N33/533 ,  G01N33/543

CPC classification number: G01N33/54373 ,  G01N33/533

Abstract: Fluorescent particles including quantum dots and fluorescent beads bound to multifunctional scaffolds can be used as taggants. The taggants can be further bound to a substrate of interest through binding sites on the multifunctional scaffolds.

Abstract translation: 包括结合到多功能支架的量子点和荧光珠的荧光颗粒可以用作标记。 标签可以通过多功能支架上的结合位点进一步与感兴趣的底物结合。

公开(公告)号：SG11201506221SA

公开(公告)日：2015-09-29

申请号：SG11201506221S

申请日：2014-02-14

Applicant: CAMBRIOS TECHNOLOGIES CORP

Inventor： ALLEMAND PIERRE-MARC ,  MANSKY PAUL ,  PICHLER KARL ,  HEIDECKER MANFRED ,  DAI HAIXIA

IPC: G02B5/02 ,  G06F3/041 ,  H01B1/22 ,  H01J11/44 ,  H05K9/00

Abstract: Disclosed herein are optical stacks comprising a plurality of silver nanostructures that are stable to light exposure by incorporating oxygen barriers, wherein the oxygen barrier may be in the form of an edge seal.

公开(公告)号：WO2009017852A3

公开(公告)日：2010-01-28

申请号：PCT/US2008060938

申请日：2008-04-18

Applicant: CAMBRIOS TECHNOLOGIES CORP ,  HEIDECKER MANFRED ,  ALLEMAND PIERRE-MARC ,  SPAID MICHAEL A ,  DAI HAIXIA

Inventor： HEIDECKER MANFRED ,  ALLEMAND PIERRE-MARC ,  SPAID MICHAEL A ,  DAI HAIXIA

IPC: H01L31/0224 ,  H01L33/00

CPC classification number: H01B1/02 ,  B22F1/0022 ,  B22F3/002 ,  B22F2001/0029 ,  B22F2998/10 ,  B82Y10/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/22 ,  H01L31/02162 ,  H05K1/097 ,  B22F1/0025

Abstract: Methods of enhancing contrast ratio of conductive nanostructure-based transparent conductors are described. Contrast ratio is significantly improved by reduction of light scattering and reflectivity of the nanostructures through steps of plating the conductive nanostructures followed by etching or oxidizing the underlying conductive nanostructures.

Abstract translation: 描述了增强基于导电纳米结构的透明导体的对比度的方法。 通过对导电纳米结构进行电镀，然后蚀刻或氧化下面的导电纳米结构的步骤，通过降低纳米结构的光散射和反射率来显着提高对比度。

公开(公告)号：WO2008147431A3

公开(公告)日：2009-03-12

申请号：PCT/US2007081281

申请日：2007-10-12

Applicant: CAMBRIOS TECHNOLOGIES CORP ,  DAI HAIXIA ,  HEIDECKER MANFRED ,  NG BENNY CHUN HEI ,  PAKBAZ HASH ,  PAUKSHTO MICHAEL ,  SPAID MICHAEL A ,  WANG CHENG-I

Inventor： DAI HAIXIA ,  HEIDECKER MANFRED ,  NG BENNY CHUN HEI ,  PAKBAZ HASH ,  PAUKSHTO MICHAEL ,  SPAID MICHAEL A ,  WANG CHENG-I

IPC: G02B5/30

CPC classification number: G02B5/3058 ,  B82Y20/00 ,  B82Y30/00 ,  G02B5/3008 ,  G02B5/3083 ,  G02F1/133536 ,  G02F2001/133548 ,  H01B1/22 ,  Y10T29/49162

Abstract: Optical films formed by deposition of highly oriented nanowires and methods of aligning suspended nanowires in a desired direction by flow-induced shear force are described.

Abstract translation: 描述了通过沉积高取向纳米线形成的光学膜和通过流动引起的剪切力在所需方向上对准悬浮的纳米线的方法。

公开(公告)号：WO2007103539A3

公开(公告)日：2008-01-24

申请号：PCT/US2007005998

申请日：2007-03-08

Applicant: CAMBRIOS TECHNOLOGIES CORP ,  ALLEMAND PIERRE-MARC ,  HEIDECKER MANFRED ,  KIRK GREGORY L ,  QUAN XINA ,  WANG CHENG-I

Inventor： ALLEMAND PIERRE-MARC ,  HEIDECKER MANFRED ,  KIRK GREGORY L ,  QUAN XINA ,  WANG CHENG-I

IPC: H01L21/20

CPC classification number: G03F7/265 ,  B82Y10/00 ,  B82Y30/00 ,  G01N33/54353 ,  G03F7/165 ,  H01L21/0237 ,  H01L21/02439 ,  H01L21/02521 ,  H01L21/02639 ,  H01L21/02645 ,  H01L21/02647

Abstract: A method of forming an integrated circuit layer material is described, comprising depositing a layer of templates on a substrate, said template including a first binding site having an affinity for the substrate, a second binding site having an affinity for a target integrated circuit material and a protecting material coupled to the second binding site via a labile linkage to prevent the binding site from binding to the target integrated circuit material; exposing the template to an external stimulus to degrade the labile linkage; removing the protecting material; and binding the integrated circuit material to the second binding site.

Abstract translation: 描述了形成集成电路层材料的方法，包括在衬底上沉积模板层，所述模板包括对衬底具有亲和性的第一结合位点，对目标集成电路材料具有亲和性的第二结合位点，以及 经由不稳定连接物耦合到第二结合位点的保护材料，以防止结合位点结合到靶集成电路材料; 将模板暴露于外部刺激以降低不稳定性联系; 去除保护材料; 并将集成电路材料结合到第二结合位点。