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公开(公告)号:DE69730734T2
公开(公告)日:2005-09-22
申请号:DE69730734
申请日:1997-12-22
Applicant: CANDESCENT INTELLECTUAL PROP
Inventor: SLUSARCZUK M , HAVEN A , CURTIN J , FAHLEN S
IPC: G02F1/13 , G02F1/1333 , G09F9/00 , H01J5/03 , H01J9/24 , H01J17/16 , H01J29/86 , H01J29/87 , H01J29/94 , H01J31/12 , H01J9/26 , H01J9/385 , H01J9/39
Abstract: A flat-panel device is fabricated by a process in which a pair of plate structures (40 and 42) are sealed along their interior surfaces (40A and 42B) to opposite edges (44A and 44B) of an outer wall (44) to form a compartment. Subsequently, exterior support structure (64) is attached to the exterior surface of one of the plate structures (40) to significantly increase resistance of the compartment to bending. Exterior support structure (66) is normally likewise attached to the exterior surface of the other plate structure (42) after the sealing operation. The compartment is then typically pumped down to a high vacuum through a suitable pump-out port (46) and closed. By providing the exterior support structure at such a relatively late stage in the fabrication process, the need for using spacers to support the device against external forces is eliminated or substantially reduced while simultaneously avoiding severe fabrication difficulties that arise in attaching the exterior support structure before the sealing operation.
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公开(公告)号:DE69430568T3
公开(公告)日:2007-04-26
申请号:DE69430568
申请日:1994-02-01
Applicant: CANDESCENT INTELLECTUAL PROP
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公开(公告)号:DE69633054T2
公开(公告)日:2005-09-01
申请号:DE69633054
申请日:1996-03-29
Applicant: CANDESCENT INTELLECTUAL PROP
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公开(公告)号:DE69730734D1
公开(公告)日:2004-10-21
申请号:DE69730734
申请日:1997-12-22
Applicant: CANDESCENT INTELLECTUAL PROP
Inventor: SLUSARCZUK M , HAVEN A , CURTIN J , FAHLEN S
IPC: G02F1/13 , G02F1/1333 , G09F9/00 , H01J5/03 , H01J9/24 , H01J17/16 , H01J29/86 , H01J29/87 , H01J29/94 , H01J31/12 , H01J9/26 , H01J9/385 , H01J9/39
Abstract: A flat-panel device is fabricated by a process in which a pair of plate structures (40 and 42) are sealed along their interior surfaces (40A and 42B) to opposite edges (44A and 44B) of an outer wall (44) to form a compartment. Subsequently, exterior support structure (64) is attached to the exterior surface of one of the plate structures (40) to significantly increase resistance of the compartment to bending. Exterior support structure (66) is normally likewise attached to the exterior surface of the other plate structure (42) after the sealing operation. The compartment is then typically pumped down to a high vacuum through a suitable pump-out port (46) and closed. By providing the exterior support structure at such a relatively late stage in the fabrication process, the need for using spacers to support the device against external forces is eliminated or substantially reduced while simultaneously avoiding severe fabrication difficulties that arise in attaching the exterior support structure before the sealing operation.
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公开(公告)号:DE69633054D1
公开(公告)日:2004-09-09
申请号:DE69633054
申请日:1996-03-29
Applicant: CANDESCENT INTELLECTUAL PROP
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公开(公告)号:DE69430568T2
公开(公告)日:2003-01-09
申请号:DE69430568
申请日:1994-02-01
Applicant: CANDESCENT INTELLECTUAL PROP
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公开(公告)号:DE69430568D1
公开(公告)日:2002-06-13
申请号:DE69430568
申请日:1994-02-01
Applicant: CANDESCENT INTELLECTUAL PROP
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