SEALING PROCESS
    1.
    发明申请
    SEALING PROCESS 审中-公开
    密封工艺

    公开(公告)号:WO03015118A3

    公开(公告)日:2003-04-24

    申请号:PCT/US0224462

    申请日:2002-08-02

    CPC classification number: H01J9/32 H01J9/261 H01J2209/268

    Abstract: A method for attaching a faceplate and a backplate (205) of a field emission display device (200). Specifically, one embodiment of the present invention discloses a method for protecting a silicon nitride passivation layer (290) from reacting with a glass seal sealing material (260) that contains lead oxide during an oven sealing or laser sealing process (350). The passivation layer (290) protects row and column electrodes (220, 230) in the display device (200). A barrier material (280) fully encapsulates the silicon nitride passivation layer (290). In one embodiment, silicon dioxide is the barrier material (280). In another embodiment, spin-on-glass is the barrier material (280). In still another embodiment, cermet is the barrier material (280).

    Abstract translation: 一种用于附接场致发射显示设备(200)的面板和背板(205)的方法。 具体而言,本发明的一个实施例公开了一种在烘箱密封或激光密封工艺(350)期间保护氮化硅钝化层(290)不与含有氧化铅的玻璃密封密封材料(260)反应的方法。 钝化层(290)保护显示装置(200)中的行和列电极(220,230)。 阻挡材料(280)完全封装氮化硅钝化层(290)。 在一个实施例中,二氧化硅是阻挡材料(280)。 在另一个实施例中,旋涂玻璃是阻挡材料(280)。 在又一个实施例中,金属陶瓷是阻挡材料(280)。

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