Abstract:
A method for forming through holes, which has laser beam as the light source to project the laser beam to the work object using an optical system through a photomask for the formation of through holes on the work object by ablation processing, comprises the steps of increasing the concentration of the optical processing energy contributing to the process using the reflected beam created from the work object in the laser ablation processing; and forming each of through holes having the configuration enabling the narrower end to be changed to the wider end in the incident direction of laser beam. With the structure thus arranged, it becomes possible to increase the energy concentration that contributes to the process as compared with the usual ablation processing, because the reflected beam created in the ablation processing can be utilized again for the optical processing. Then, each of the through holes can be formed easily in the configuration in which the narrower end changes to the wider end in the incident direction of laser beam, which cannot be easily processed by the application of the usual ablation processing.
Abstract:
A femtosecond laser is employed and sublimation working is conducted by illuminating a mask pattern by scanning asynchronously with the laser oscillation, thereby forming an integrated image of the speckle interference image generated by the diffraction of the laser beam passing through the mask pattern, and moving the workpiece in synchronization with the movement of the pattern image, whereby a laser working method free from generation of by-products and capable of conducting highly precise working, suppressing speckle interference in the working by mask projection, thereby precisely reproducing the fine mask pattern, and working the workpiece by projection of a large-area pattern, a method for producing an ink jet recording head utilizing such laser working method and an ink jet recording head produced by such producing method are provided.
Abstract:
An achromatic-type scanning optical arrangement includes a laser source, a first optical system for converging a beam of light emanating from the laser source, a deflecting device for deflecting the beam of light converged by the first optical system and a second optical system for focusing the beam of light deflected by the deflecting device onto a predetermined position. The entire optical system including the first optical system (12) and the second optical system is corrected for chromatic aberration, as a whole, to eliminate the adverse influence of wavelength variations in the laser source upon variations in the focus position of the aforesaid beam of light.
Abstract:
The invention provides a laser etching method for optical ablation working by irradiating a work article formed of an inorganic material with a laser light from a laser oscillator capable of emitting in succession light pulses of a large energy density in space and time with a pulse radiation time not exceeding 1 picosecond, wherein, in laser etching of the work article formed of the inorganic material by irradiation thereof with the laser light from the laser oscillator with a predetermined pattern and with a predetermined energy density, there is utilized means for preventing deposition of a work by-product around the etching position.
Abstract:
A laser processing method for performing laser ablation process on a work piece by radiating laser beam on the work piece comprises the step of forming simultaneously a plurality of process shapes arranged at a predetermined interval by use of laser beam of plural pulses having extremely large spatial and temporal energy density radiated from a laser oscillator as the laser beam oscillating at the pulse radiation time of one picosecond or less. With the laser processing method thus structured, it is possible to perform a highly precise processing without creating by-product, as well as to fundamentally prevent the converted thermal energy from being accumulated on a work piece, such as resin, which causes the work piece to be fused or thermally expanded during the operation of laser processing.
Abstract:
The invention provides a laser working method free from generation of by-products and capable of preventing accumulation of thermal energy generating during the laser working, in a workpiece made, for example, of a resinous material, thereby precisely reproducing a minute mask pattern, also a method for producing an ink jet recording head utilizing such a laser working method and an ink jet recording head produced by such a producing method. There is employed laser light in more than one pulse having a very high energy density in space and time, as emitted from a laser oscillator that can oscillate with a pulse radiation time not exceeding 1 picosecond, and a speckle interference image generated by light diffraction at the passing of the laser light through the mask pattern is dynamically changed to form an integrated image of the speckle interference image, whereby a pattern substantially the same as the mask pattern can be formed.
Abstract:
A method for manufacturing an ink jet recording head in which an ink discharge port for discharging an ink droplet to be adhered to a recording medium, a liquid chamber for containing ink to be supplied to the ink discharge port, an ink low path for communicating the ink discharge port with the liquid chamber, an energy generating element provided in the ink flow path and adapted to generate energy for discharging the ink and an ink supply opening for supplying the ink from exterior into the liquid chamber are formed by bonding or adhering plate members. In the method when an orifice plate in which the ink discharge port is formed is subjected to laser working, a laser light of plural pulses having very great spatial and time energy density and emitted from a laser oscillator for oscillating the laser light at a pulse emitting time smaller than 1 pico-second is used, and the laser beam is illuminated from an outer surface side of the orifice plate which is opposite to an ink supplying side thereby to form an ink discharge port working pattern on the outer surface of the orifice plate by focus projection.