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    HIGH-FREQUENCY PROBE
    1.
    发明专利
    HIGH-FREQUENCY PROBE 审中-公开

    公开(公告)号：JP2006343334A

    公开(公告)日：2006-12-21

    申请号：JP2006159061

    申请日：2006-06-07

    Applicant: CASCADE MICROTECH INC

    Inventor： CAMPBELL RICHARD L ,  ANDREWS MICHAEL ,  BUI LYNH

    IPC: G01R1/067 ,  G01R31/26 ,  H01L21/66

    Abstract: PROBLEM TO BE SOLVED: To provide a probe capable of reducing a stray electromagnetic field in the vicinity of a probe tip part to reduce a crosstalk with a neighboring device, capable of making a sufficient current flow, and allowing probing at a high-frequency. SOLUTION: This high-frequency probe has a contact point end part positioned within an end part circumferential edge of a coaxial cable, and shielded by a grounding conductor of the coaxial cable. COPYRIGHT: (C)2007,JPO&INPIT

    HIGH FREQUENCY INTERCONNECT STRUCTURES, ELECTRONIC ASSEMBLIES THAT UTILIZE HIGH FREQUENCY INTERCONNECT STRUCTURES, AND METHODS OF OPERATING THE SAME
    3.
    发明申请
    HIGH FREQUENCY INTERCONNECT STRUCTURES, ELECTRONIC ASSEMBLIES THAT UTILIZE HIGH FREQUENCY INTERCONNECT STRUCTURES, AND METHODS OF OPERATING THE SAME 审中-公开
    高频互连结构，利用高频互联结构的电子组件及其操作方法

    公开(公告)号：WO2012167014A2

    公开(公告)日：2012-12-06

    申请号：PCT/US2012040366

    申请日：2012-06-01

    Applicant: CASCADE MICROTECH INC ,  STRID ERIC W ,  CAMPBELL RICHARD L ,  SMITH KENNETH R ,  GLEASON K REED ,  JUNG KOOHO

    Inventor： STRID ERIC W ,  CAMPBELL RICHARD L ,  SMITH KENNETH R ,  GLEASON K REED ,  JUNG KOOHO

    IPC: H01P5/12

    CPC classification number: G01R23/02 ,  H01P3/16 ,  H01P3/18

    Abstract: High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.

    Abstract translation: 高频互连结构，利用高频互连结构的电子组件及其操作方法。 高频互连结构包括多个介质波导，并且被配置为将多个发射器与多个接收器通信连接并且在其间传送多个信号。 多个信号可以包括多个电磁波，并且可以具有至少200GHz的频率。 高频互连结构还可以被配置为降低由多个介质波导的第一介电波导传送的第一信号与由多个介质波导的第二介质波导传送的第二信号之间的串扰的电位 波导，例如通过控制第一介电波导相对于第二介质波导的通带和/或使用串扰减轻结构。

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