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公开(公告)号：JPH02172303A
公开(公告)日：1990-07-03
申请号：JP27877889
申请日：1989-10-27
Applicant: CASCADE MICROTECH INC
Abstract: PURPOSE: To minimize the variation of impedance by using an overlapped end part of a different shape between respective signal lines/ground lines of transmission lines for interface structure for connecting a pair of shared face transmission lines. CONSTITUTION: In a pair of shared face transmission lines 20, 20a, each end part 24 or 25 of one transmission line 20 has lateral dimensions larger than the dimensions of the end part 24a or 25a of the other transmission line 20a and the end parts 24a, 25a have lateral dimensions remarkably reduced from the remaining parts of respective lines. In the case of overlapping narrow corresponding end part 24a or 25a, respective end parts 24, 25 have excessively conductive materials 21', 23', and when respective transmission lines 21, 21a are unaligned in the lateral direction, the lateral dimensions 26 of the signal line end part and a lateral interval between the signal line end part and a ground line end part are included within the valid limit of non-alignment. Consequently the impedance variation of the interface can be minimized.
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公开(公告)号：JPH02187666A
公开(公告)日：1990-07-23
申请号：JP28729289
申请日：1989-11-02
Applicant: CASCADE MICROTECH INC
Abstract: PURPOSE: To replace a probe chip economically by connecting a connector with a detachable probe chip through a flat dielectric circuit board having a transmission line of flat conductor and making the circuit board detachable and fixing circuit components. CONSTITUTION: A ground line 16 and a signal line 18 are provided on a dielectric elastic board 20 and a coplanar transmission line probe chip 14 is formed. A transmission line circuit board 26 connecting a connector 12 and a chip 14 operably is also provided. The circuit board 26 is detachable and includes a ground line 28 and a signal line 30 which are jointed with the ground line 16 and signal line 18 of the chip 14 while overlapping in the longitudinal direction. Circuit parts are mounted previously on the circuit board 26. According to the structure, only the chip 14 can be replaced when it is damaged and since the circuit components are fixed closely to the chip 14, phase shift and signal loss are reduced.
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公开(公告)号：JPH08288342A
公开(公告)日：1996-11-01
申请号：JP8365996
申请日：1996-04-05
Applicant: CASCADE MICROTECH INC
Inventor： ERITSUKU DABURIYUU SUTORAIDO , JIERII BII SHIYAPATSUCHIYAA , KEI RIIDO GURIISON , DEIRU II KAARUTON
Abstract: PROBLEM TO BE SOLVED: To provide an interconnect assembly which is used for evaluating the signal condition in a probe measuring network. SOLUTION: This system is provided with a base 62, individual internal probe areas 98, individual external probe areas 100, a reference connecting part 110, and a high frequency transmission structure part 106 which can connects a planar probe are with the reference connecting part 110 in such a manner that a high frequency signal can be uniformly transmitted when the tip position of a device measuring probe in a network on a probe area changes. In the evaluation of a signal channel of a probe measuring network, a reference unit is connected with the reference connecting part, and each device measuring probe tip corresponding to an aimed signal channel is sequentially positioned on the internal probe area. Since the transmission structure part transmits a signal uniformly, the relative condition of a signal inputted in or outputted from each of the probe tip almost coincide with the condition of a signal measured or supplied by the reference unit.
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