公开(公告)号：US20240008171A1

公开(公告)日：2024-01-04

申请号：US18143133

申请日：2023-05-04

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Wei-Teng Lin ,  Hui-Yu Huang ,  Ching-Chi Chan ,  Shih-Chieh Chang

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/498

CPC classification number: H05K1/0272 ,  H01L24/32 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2224/32225 ,  H01L2224/26175 ,  H01L2924/15151

Abstract: A semiconductor package includes a chip, a circuit board and a filling material. The circuit board includes a substrate, a patterned metal layer and a protective layer. A circuit area, a chip-mounting area and a flow-guiding area are defined on a surface of the substrate. The chip is mounted on the chip-mounting area. A flow-guiding member of the patterned metal layer is arranged on the flow-guiding area and includes a hollow portion and flow-guiding grooves which are communicated with the hollow portion and arranged radially. The flow-guiding grooves are provided to allow the protective layer to flow toward the hollow portion, and the hollow portion and the flow-guiding grooves are provided to allow the filling material to flow toward the protective layer such that the filling material can cover the protective layer to improve structural strength of the semiconductor package.