公开(公告)号：US20230420287A1

公开(公告)日：2023-12-28

申请号：US18137799

申请日：2023-04-21

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Ching-Wen Chen ,  Chen-Lung Teng ,  Kung-An Lin ,  Chen-Yu Wang

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68721 ,  H01L21/67092 ,  H01L21/68735

Abstract: A clamp assembly includes at least one clamp which is provided to clamp a workpiece in electroless plating, etching, electroplating or cleaning process. The clamp includes a base, a clamping element and a limiting element. The base is mounted on a carrier and includes a guide hole and a first limiting hole which are communicated with each other. The clamping element includes a guide rod and a second limiting hole, the guide rod is inserted into the guide hole to allow the second limiting hole located on the guide hole to be communicated with the first limiting hole. The limiting element is inserted into the first and second limiting holes to integrate the base with the clamping element for clamping the workpiece.