公开(公告)号：US20210185800A1

公开(公告)日：2021-06-17

申请号：US16866796

申请日：2020-05-05

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yi-Chen Lien ,  Yen-Ping Huang ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02 ,  H05K3/00

Abstract: A circuit board includes a substrate having a through hole, a circuit layer, a first measurement mark and a second measurement mark. According to the first and second measurement marks, an electronic detection device can measure a first distance between a first edge of the through hole and the first measurement mark and a second distance between a second edge of the through hole and the second measurement mark to determine whether the through hole has an undesired size or shift.

公开(公告)号：US20230380072A1

公开(公告)日：2023-11-23

申请号：US18109334

申请日：2023-02-14

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yi-Hui Chen ,  Yi-Hua Huang ,  Yen-Ping Huang ,  Shih-Chieh Chang

IPC: H05K3/04

CPC classification number: H05K3/041 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0191 ,  H05K2203/0278

Abstract: A manufacturing method of tape includes the steps of providing a tape including substrate units, providing a die device and a cutting and/or pressing process. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader, the heat spreader is attached onto the carrier by the adhesive. In the cutting and/or pressing process, the die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.