公开(公告)号：US20240219447A1

公开(公告)日：2024-07-04

申请号：US18129907

申请日：2023-04-03

Applicant: CHROMA ATE INC.

Inventor： WEI-CHIH CHEN ,  SHEN-HAO TSAI ,  YI-YEN LIN

IPC: G01R31/26 ,  G01R1/067

CPC classification number: G01R31/2601 ,  G01R1/06716 ,  G01R1/06761

Abstract: A wafer inspection system includes a carrier device, a probe card, a first metal kit and a surround separating unit. The probe card includes a detection portion and a conductive layer surrounding the detection portion and configured at a bottom surface of the probe card. The first metal kit is configured at a bottom portion of the probe card and coupled to the conductive layer and includes a first window and a first ring piece extending from a periphery of the first window. The first window is for the detection portion to extend out. The surround separating unit is configured as an electrically conductive wraparound unit surrounding and laterally enclosing the detection portion and a wafer to be inspected when the probe card performs a probe procedure on the wafer to be inspected. Thus, a probe procedure of the detection portion and the wafer to be inspected can be performed in an environment shielded from external noise or interference sources, thereby improving inspection accuracy.