公开(公告)号：US20220034956A1

公开(公告)日：2022-02-03

申请号：US17337954

申请日：2021-06-03

Applicant: CHROMA ATE INC.

Inventor： WEI-CHIH CHEN ,  BEN-MOU YU ,  YI-YEN LIN

IPC: G01R31/26 ,  G01R31/28 ,  G01N21/95

Abstract: A wafer inspection system and a wafer inspection equipment thereof are provided. The wafer inspection system includes a susceptor device, probe card, and bridge module. The susceptor device includes a susceptor unit for placing a wafer under test. The probe card includes a probing portion and conducting portion. The conducting portion is disposed at the periphery of the probing portion and has a contact surface. The bridge module includes transmission units extended upward, positioned adjacent to a wafer placement area, and coupled to the susceptor unit. When the probing portion comes into contact with a testing point of the wafer, the contact surface of the conducting portion gets coupled to the transmission units to transmit a test signal to the probe card via the transmission units and conducting portion and thus form a test loop. Thus, the test loop path can be shortened and the accuracy of signal transmission and inspection can be enhanced.

公开(公告)号：US20240219447A1

公开(公告)日：2024-07-04

申请号：US18129907

申请日：2023-04-03

Applicant: CHROMA ATE INC.

Inventor： WEI-CHIH CHEN ,  SHEN-HAO TSAI ,  YI-YEN LIN

IPC: G01R31/26 ,  G01R1/067

CPC classification number: G01R31/2601 ,  G01R1/06716 ,  G01R1/06761

Abstract: A wafer inspection system includes a carrier device, a probe card, a first metal kit and a surround separating unit. The probe card includes a detection portion and a conductive layer surrounding the detection portion and configured at a bottom surface of the probe card. The first metal kit is configured at a bottom portion of the probe card and coupled to the conductive layer and includes a first window and a first ring piece extending from a periphery of the first window. The first window is for the detection portion to extend out. The surround separating unit is configured as an electrically conductive wraparound unit surrounding and laterally enclosing the detection portion and a wafer to be inspected when the probe card performs a probe procedure on the wafer to be inspected. Thus, a probe procedure of the detection portion and the wafer to be inspected can be performed in an environment shielded from external noise or interference sources, thereby improving inspection accuracy.