TOUCH MAPPING
    1.
    发明申请
    TOUCH MAPPING 审中-公开
    触摸贴图

    公开(公告)号:WO2015007284A1

    公开(公告)日:2015-01-22

    申请号:PCT/DK2014/000038

    申请日:2014-07-15

    Applicant: COLOPLAST A/S

    CPC classification number: A61F5/4404 A61F5/443

    Abstract: A method of monitoring the pressure applied to an ostomy appliance during application to the skin, the ostomy appliance comprising an adhesive wafer comprising a backing layer facing away from the skin and an adhesive layer for attachment to the skin, the method comprising the steps of: providing sensing means capable of recording application of pressure to the wafer, applying the adhesive wafer to the skin surrounding the stoma by applying pressure to the sensing means and wafer and retrieving the recorded data from the sensing means.

    Abstract translation: 一种在施用于皮肤期间监测施加到造口术器具的压力的方法,所述造口术器具包括粘合剂晶片,所述粘合剂晶片包括背离皮肤的背衬层和用于附着到皮肤的粘合剂层,所述方法包括以下步骤: 提供能够记录对晶片施加压力的感测装置,通过向感测装置和晶片施加压力并从感测装置检索记录的数据,将粘合剂晶片施加到造口周围的皮肤。

    TOUCH MAPPING
    2.
    发明公开
    TOUCH MAPPING 有权
    DRUCKABBILDUNG

    公开(公告)号:EP3021801A1

    公开(公告)日:2016-05-25

    申请号:EP14742144.0

    申请日:2014-07-15

    Applicant: Coloplast A/S

    CPC classification number: A61F5/4404 A61F5/443

    Abstract: A method of monitoring the pressure applied to an ostomy appliance during application to the skin, the ostomy appliance comprising an adhesive wafer comprising a backing layer facing away from the skin and an adhesive layer for attachment to the skin, the method comprising the steps of: providing sensing means capable of recording application of pressure to the wafer, applying the adhesive wafer to the skin surrounding the stoma by applying pressure to the sensing means and wafer and retrieving the recorded data from the sensing means.

    Abstract translation: 一种在施用于皮肤期间监测施加到造口术器具的压力的方法,所述造口术器具包括粘合剂晶片,所述粘合剂晶片包括背离皮肤的背衬层和用于附着到皮肤的粘合剂层,所述方法包括以下步骤: 提供能够记录对晶片施加压力的感测装置,通过向感测装置和晶片施加压力并从感测装置检索记录的数据,将粘合剂晶片施加到造口周围的皮肤。

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