-
公开(公告)号：JPH10340674A
公开(公告)日：1998-12-22
申请号：JP14192898
申请日：1998-05-22
Applicant: COMMISSARIAT ENERGIE ATOMIQUE
Inventor： PERRIN AIME , JEAN-FRANCOIS BORONAT , DANEL JEAN-SEBASTIEN , DELAPIERRE GILLES
Abstract: PROBLEM TO BE SOLVED: To provide a spacer being applicable even to a high-resolution screen with a large space between electrodes for working at high voltage. SOLUTION: In a manufacturing method of this spacer, the spacer for a flat type display screen high voltage controlled and equipped with image members or picture elements divided into plurality is collectively produced. A substrate is anisotropically etched so as to leave the spacer 50 with a cross section being formed into a shape capable of insertion between picture elements 90 without covering the picture elements 90, and the spacer 50 is removed from the substrate then the spacer 50 is arranged on a fixed position on the flat type display screen.
-
公开(公告)号：JPS554092A
公开(公告)日：1980-01-12
申请号：JP7639479
申请日：1979-06-19
Applicant: COMMISSARIAT ENERGIE ATOMIQUE
Inventor： DELAPIERRE GILLES , MEYER ROBERT
-
3.发明申请ENCAPSULATED MICROSTRUCTURE AND METHOD OF PRODUCING ONE SUCH MICROSTRUCTURE 审中-公开包封微观结构和生产一种这样的微观结构的方法
公开(公告)号：WO2004058628A3
公开(公告)日：2004-08-19
申请号：PCT/FR0350189
申请日：2003-12-18
Applicant: COMMISSARIAT ENERGIE ATOMIQUE , DIEM BERNARD , DELAPIERRE GILLES
Inventor： DIEM BERNARD , DELAPIERRE GILLES
CPC classification number: B81B7/007 , B81C2203/0145
Abstract: The invention relates to an encapsulated microstructure and to a method of producing one such microstructure. The inventive microstructure comprises a first layer which is insulated from a substrate (6) by an insulting layer (7), said first layer containing: at least one sensitive element (1) which is connected to at least one contact pad (3) by means of an electrical connection (2) and which is protected by a cap (5). According to the invention, the sensitive element (1), the electrical connection (2) and the contact pad (3) form an assembly (10) that is defined in the first layer by at least one channel (11), said assembly (10) being covered by the cap (5). The cap (5), which comprises at least one opening (12) above the contact pad (3), is solidly connected to (i) the contact pad (3) at the periphery of the opening (12) and (ii) an area (9) located beyond the channel (11) in relation to the assembly (10). The invention is suitable for micro-electro-mechanical structures.
Abstract translation: 本发明涉及一种封装的微结构和一种制造这种微结构的方法。 本发明的微结构包括通过绝缘层（7）与衬底（6）绝缘的第一层，所述第一层包含：至少一个敏感元件（1），其通过至少一个接触垫 电连接（2）的装置并且由帽（5）保护。 根据本发明，敏感元件（1），电连接（2）和接触垫（3）形成通过至少一个通道（11）限定在第一层中的组件（10），所述组件 10）被盖帽（5）覆盖。 包括在接触垫（3）上方的至少一个开口（12）的帽（5）牢固地连接到（i）在开口（12）的周边处的接触垫（3），和（ii） 区域（9）相对于组件（10）位于通道（11）之外。 本发明适用于微机电结构。
-
公开(公告)号：DE60213046T2
公开(公告)日：2007-07-05
申请号：DE60213046
申请日：2002-05-07
Applicant: COMMISSARIAT ENERGIE ATOMIQUE
Inventor： DELAPIERRE GILLES
IPC: F42D1/05 , F41A19/65 , F42B3/113 , H01M8/0606
Abstract: The module is designed for supplying hydrogen to a fuel mini-cell, wherein hydrogen is gradually released by combustion of elements made of pyrotechnic material, after ignition. A device for sequential control of ignition of the pyrotechnic elements comprises a circuit controlling an electrical or light energy source which supplies an ignition control signal causing energy to be applied to the input of a series of connecting means, respectively associated with each of the pyrotechnic elements. A single pyrotechnic element is connected to the energy source at any one time, the elements preceding it having already been used. The connecting means can be sensitive to temperature or to pressure.
-
公开(公告)号：FR2836907B1
公开(公告)日：2005-03-18
申请号：FR0203016
申请日：2002-03-11
Applicant: COMMISSARIAT ENERGIE ATOMIQUE
Inventor： DELAPIERRE GILLES
Abstract: The microvalve has a mini-piston moving due to thrust of gases given off by firing of pyrotechnic charge (20). An aperture establishes communication between ends of microchannels of a micorfluidic component. A mini-position is formed in a substrate, when the ends between which the communication is established is open out on to a face of another substrate. The mini-position has a rod (24) that slides into a transverse slot (25) to form an aperture by a transverse orifice, when a clot is placed between the ends of the microchannels.
-
Patent Agency Ranking
公开(公告)号：FR2849013B1
公开(公告)日：2005-03-11
申请号：FR0216274
申请日：2002-12-20
Applicant: COMMISSARIAT ENERGIE ATOMIQUE
Inventor： DELAPIERRE GILLES
Abstract: The microsystem encapsulation component (2) is integrated in a cavity with a substrate (1) forming the base and an upper cap (3) with a seal (4). The cap has a groove (5) forming a peripheral (7) and central zone (6). The sealing material is placed at the base of the groove.
-
公开(公告)号：FR2818808A1
公开(公告)日：2002-06-28
申请号：FR0016941
申请日：2000-12-22
Applicant: COMMISSARIAT ENERGIE ATOMIQUE
Inventor： BLOCH DIDIER , DELAPIERRE GILLES , PRIEM THIERRY , MARSACQ DIDIER , LAURENT JEAN YVES , GAUTHIER CORINNE , PERUT CHRISTIAN
IPC: C01B3/00 , H01M2/10 , H01M8/00 , H01M8/04119 , H01M8/0606 , H01M8/065 , H01M8/06
Abstract: The invention concerns a fuel cell (2) of the type comprising an anode (12) and a cathode (10), between which is interposed an electrolyte (18). Solid bodies (20) storing a hydrogen mass, capable of being decomposed by combustion, are associated with pyrotechnic means (24, 26) to release the hydrogen and contact it with the anode (12). Means (38) tap ambient air to bring it into contact with the cathode (10). The ignition of the pyrotechnic means (24, 26) is subjected to addressing means (28) integrated in the appliance (2). The water surplus produced by the exchange between hydrogen and oxygen is absorbed by the rise in temperature induced by the combustion of the bodies (20). The solid bodies (20) are supported by an interchangeable card (22).
-
公开(公告)号：FR2770683A1
公开(公告)日：1999-05-07
申请号：FR9713794
申请日：1997-11-03
Applicant: COMMISSARIAT ENERGIE ATOMIQUE
Inventor： PERRIN AIME , MONTMAYEUL BRIGITTE , DELAPIERRE GILLES
Abstract: The invention concerns a method which consists in making a structure comprising a substrate (10), at least one cathode conductor (12), a first insulating layer (14), a grid layer (16) and a second insulating layer (71). It consists in forming holes through the insulating layers and the grid layer, in forming a deposit (80) of a material emitting electrons in the holes up to the upper level thereof, treating this deposit to minimise or prevent a chemical etching from the top thereof, eliminating the second insulating layer and carrying out a chemical etching of the material to obtain the microtips. The invention is useful for making flat screens.
-
公开(公告)号：FR2727648B1
公开(公告)日：1997-01-03
申请号：FR9414461
申请日：1994-12-01
Applicant: COMMISSARIAT ENERGIE ATOMIQUE
Inventor： FOUILLET YVES , DELAPIERRE GILLES , DELAYE MARIE THERESE
Abstract: The method consists of forming at least one groove (110) in the surface (112) of a first substrate (114), assembling the first substrate with a second substrate (116) which covers the groove and forms a channel, and forming a protective coating on the inside of the channel by thermal oxidation of its walls. The first and second substrates are then cut perpendicular to the channel to form the nozzle (118) for the liquid jet, and the interior protective coating is removed. The two substrates can be machined to form an orifice (140) and/or a reservoir for feeding the nozzles. The first and second substrates are made from silicium, and the inner coating is of silicium oxide, which is removed in a hydrofluoric acid bath.
-
公开(公告)号：FR2723799B1
公开(公告)日：1996-09-20
申请号：FR9410041
申请日：1994-08-16
Applicant: COMMISSARIAT ENERGIE ATOMIQUE
Inventor： DELAPIERRE GILLES , MEYER ROBERT
Abstract: A micro-tip electron source prodn. process involves: (a) producing a structure comprising an insulating substrate (10) bearing one or more cathode conductors (12) covered with an insulating layer (14) and then a conductive grid layer (16), holes (18) being formed through these layers (14,16) to each cathode conductor (12); and (b) forming a micro-tip of electron-emissive metal on the cathode conductor (12) in each hole (18), and an insulating protective layer (50) on the grid layer (16), depositing (pref. electrolytically) electron-emissive metal to overfill the holes, removing the protective layer and electrolytically etching the metal deposit (60) to form the micro-tips.
-
-
-
-
-
-
-
-
-
Search Results
93
records
(took 0.023 seconds)
