Abstract:
PROBLEM TO BE SOLVED: To provide a new material to coat contact points of an electric connector with. SOLUTION: The contact points (3, 7) made of a metal base material are covered with homogeneous and adherent organic polymer film with thickness of 5 to 500 nm and its contact resistance is less than 10 Ω. The polymer film can be accreted by electric polymerization of monomeric substance like acrylic nitrite. In order to improve electric conductivity and make the contact resistance smaller than 10 Ω, it is treated by heat or by irradiation.
Abstract:
The invention relates to a method for functionalising a surface of a solid substrate with at least one acrylic acid polymer layer, said method comprising the steps of: i) placing said surface in contact with a solution consisting of at least one acrylic acid homopolymer, a solvent and, optionally, metal salts; ii) removing the solvent from the solution in contact with said surface; and iii) binding the polymer to said surface by thermal treatment.
Abstract:
One subject of the present invention is a non-electrochemical process for radical grafting of a polymer to a solid, organic or inorganic and insulating, electrically conductive or electrically semiconductive substrate, which process comprises - bringing said substrate into contact with the polymer in solution via an immersion-emersion, a contact coating, or a spray coating, and - heat treating the polymer-covered substrate obtained in the preceding step at a temperature between 70°C and 450°C; said polymer not being a polymer based on acrylic acid. The invention also relates to a process for metallizing the solid, organic or inorganic substrate coated by the polymer film, which metallizing may be carried out via a dry or wet route. This process particularly finds an application in the metallization of through vias for the manufacture of semiconductor devices.
Abstract:
The invention relates to a method for preparing a metallised substrate, comprising the following steps consisting in: grafting a polymer-type compound to the substrate, said compound optionally having a group capable of chelating at least one metal ion; bringing the aforementioned compound, which is capable of chelating at least one metal ion, into contact with at least one metal ion, exposing said polymer-type compound to conditions that allow the reduction of the chelated metal ion(s) and repeating the chelation/reduction steps until a metallised substrate is obtained. The invention also relates to the resulting substrates and to the uses thereof.
Abstract:
The invention concerns a method for grafting and growing a conductive organic film on an electrically conductive or semiconductive surface, wherein film is simultaneously grafted and grown by electrochemical reduction of a diazonium salt precursor of said film on said surface cathodically polarized to a potential not less in absolute value than the electrochemical reduction potential of the diazonium salt relative to a reference electrode. The invention is useful in particular for protecting surfaces, making localised conductive coatings, chemical sensors, in the fields of chemistry and molecular biology, for making biomedical equipment and the like.
Abstract:
One subject of the present invention is a non-electrochemical process for radical grafting of a polymer to a solid, organic or inorganic and insulating, electrically conductive or electrically semiconductive substrate, which process comprises - bringing said substrate into contact with the polymer in solution via an immersion-emersion, a contact coating, or a spray coating, and - heat treating the polymer-covered substrate obtained in the preceding step at a temperature between 70°C and 450°C; said polymer not being a polymer based on acrylic acid. The invention also relates to a process for metallizing the solid, organic or inorganic substrate coated by the polymer film, which metallizing may be carried out via a dry or wet route. This process particularly finds an application in the metallization of through vias for the manufacture of semiconductor devices.
Abstract:
The invention relates to a complexing system for extracting a radionuclide from a waste solution comprising calix[n]arene groups immobilized on the surface of a porous conducting material.
Abstract:
The present invention relates to a method for assembling at least one area of a first surface with at least one area of a second surface or with a molecule of interest, including a step consisting of placing said area of said first surface in contact with said area of said second surface or with said molecule of interest, wherein said area of said first surface exhibits at least one radical and/or ionic entity. The present invention also relates to a solid substrate the surface of which has at least one area with at least one radical and/or ionic entity, with at least one adhesion primary, or with at least one precursor of an adhesion primary, and to the various uses thereof.
Abstract:
L'invention concerne un procédé pour fonctionnaliser une surface d'un support solide avec au moins une couche polymère à base d'acide acrylique, ledit procédé comprenant les étapes de : i) mise en contact de ladite surface avec une solution comprenant : - un polymère à base d'acide acrylique ; - un solvant ; Ladite solution ne comprenant pas de primaire d'adhésion à base de sels d'aryle clivables ; ii) élimination du solvant de la solution en contact avec ladite surface ; et iii) Fixation du polymère sur ladite surface par traitement thermique ou radiatif.
Abstract:
The present invention relates to a method for assembling at least one area of a first surface with at least one area of a second surface or with a molecule of interest, including a step consisting of placing said area of said first surface in contact with said area of said second surface or with said molecule of interest, wherein said area of said first surface exhibits at least one radical and/or ionic entity. The present invention also relates to a solid substrate the surface of which has at least one area with at least one radical and/or ionic entity, with at least one adhesion primary, or with at least one precursor of an adhesion primary, and to the various uses thereof.