公开(公告)号：WO2019236203A2

公开(公告)日：2019-12-12

申请号：PCT/US2019/028459

申请日：2019-04-22

Applicant: COMMSCOPE TECHNOLOGIES LLC

Inventor： XU, YongJie ,  PATEL, Sammit ,  BROBSTON, Michael ,  GU, Qiyun

IPC: H01Q1/22

Abstract: Active antennas are provided that include a housing having a front surface, first and second side surfaces and a rear surface, where the front surface comprises a radome and the first and second side surfaces comprise respective first and second thermally-conducting frame members. These antennas further include at least one radio that is completely mounted within an interior of the housing. Each of the first and second thermally-conducting frame members includes a plurality of outwardly extending fins.

公开(公告)号：WO2019236203A3

公开(公告)日：2019-12-12

申请号：PCT/US2019/028459

申请日：2019-04-22

Applicant: COMMSCOPE TECHNOLOGIES LLC

Inventor： XU, YongJie ,  PATEL, Sammit ,  BROBSTON, Michael ,  GU, Qiyun

IPC: H01Q19/10 ,  H01Q1/42 ,  H01Q1/02

Abstract: Active antennas are provided that include a housing having a front surface, first and second side surfaces and a rear surface, where the front surface comprises a radome and the first and second side surfaces comprise respective first and second thermally-conducting frame members. These antennas further include at least one radio that is completely mounted within an interior of the housing. Each of the first and second thermally-conducting frame members includes a plurality of outwardly extending fins.

公开(公告)号：WO2015179089A1

公开(公告)日：2015-11-26

申请号：PCT/US2015/028237

申请日：2015-04-29

Applicant: COMMSCOPE TECHNOLOGIES LLC

Inventor： PATEL, Sammit, A. ,  XU, Yongjie ,  GU, Qiyun ,  BROWN, Richard, W.

IPC: H01L23/427 ,  H05K7/20

CPC classification number: H03F1/301 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/66 ,  H01L29/7816 ,  H01L2023/4031 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2223/6644 ,  H01L2924/0002 ,  H03F3/213 ,  H03F2200/411 ,  H03F2200/447 ,  H03F2200/451 ,  H05K1/0203 ,  H05K1/183 ,  H05K3/3421 ,  H05K3/3463 ,  H05K7/2029 ,  H05K7/20336 ,  H05K7/20936 ,  H05K2201/064 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10166 ,  H01L2924/00

Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.

Abstract translation: 在一个实施例中，电子系统包括印刷电路板，一个或多个封装的半导体器件，以及具有顶部和底部并且封闭部分地填充有冷却剂的密封腔的蒸气室。 蒸气室包括热导和导电材料。 蒸汽室的顶部具有形成在其中的一个或多个凹陷，每个凹陷接收并热导通地连接到相应的封装半导体器件的底部的至少部分，其通过PCB中的相应孔安装。 散热器可以热传导地连接到蒸气室的底部。

公开(公告)号：EP3794682A2

公开(公告)日：2021-03-24

申请号：EP19814738.1

申请日：2019-04-22

Applicant: CommScope Technologies LLC

Inventor： XU, YongJie ,  PATEL, Sammit ,  BROBSTON, Michael ,  GU, Qiyun

IPC: H01Q19/10 ,  H01Q1/42 ,  H01Q1/02

公开(公告)号：EP3709434A1

公开(公告)日：2020-09-16

申请号：EP20162424.4

申请日：2020-03-11

Applicant: CommScope Technologies LLC

Inventor： LI, Xianxiang ,  LV, Yangzhun ,  MI, Qing ,  GU, Qiyun ,  RESNATI, Giuseppe

IPC: H01P1/205

Abstract: A band-stop filter comprises: a housing having a top wall, a bottom wall and at least one side wall, the housing defining an internal cavity; a signal input port and a signal output port that are respectively disposed on one of the at least one side wall; a resonating element that is disposed in the internal cavity and includes a top, a bottom, and a side; and a transmission line that is disposed in the internal cavity and coupled between the signal input port and the signal output port, the transmission line comprising a coupling section that is coupled to the resonating element, wherein the coupling section is configured to surround more than half of the side of the resonating element and not directly contact the housing and the resonating element.