公开(公告)号：JPH0661393A

公开(公告)日：1994-03-04

申请号：JP10674492

申请日：1992-04-24

Applicant: CONS RIC MICROELETTRONICA

Inventor： MARUKANTONIO MANJIAGURU ,  ROZARIO POGURIEZE

IPC: H01L23/48 ,  H01L23/495

Abstract: PURPOSE: To perform capsule sealing into a resin, perform insulation completely, and stand at least AC 2,250 V by setting the minimum distance of a gap between a central conductor section closest to a covering and the side part conductor section between two continuous curved parts to a clearance distance or less. CONSTITUTION: External conductors 28 and 29 indicate two curved parts that are nearly at right angle near a plastic covering 21, the curved parts have their terminal parts on surfaces that are in parallel with a heat dissipation equipment 26, and a surface where the terminal part of a conductor 27 is located is directed toward the heat dissipation equipment and is located at a distance that is longer than a distance being expressed. Then, a distance between curved parts at the right angle of the same one side edge parts is properly selected, thus preventing the distance between the edge of the central conductor 27 and the edges of side part conductors 28 and 29 from being lower than a limit that is applied to a clearance distance with the maximum withstand voltage, thus obtaining a semiconductor device that can completely satisfy the international standard and can withstand a high voltage.