公开(公告)号：WO2007111610A1

公开(公告)日：2007-10-04

申请号：PCT/US2006/011527

申请日：2006-03-28

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： SPAUNHORST, Vernon, Raymond

IPC: H01H85/041 ,  H01H69/02

CPC classification number: H01H85/0411 ,  H01H69/022 ,  H01H85/046 ,  H01H85/143 ,  H01H2069/025 ,  H01H2085/0412 ,  H01H2085/266 ,  H01L24/01 ,  H05K3/3426 ,  H05K2201/10181 ,  H05K2201/10583 ,  H05K2201/10651 ,  Y02P70/613

Abstract: A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the rase element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.

Abstract translation: 芯片熔丝包括衬底，在衬底上延伸的熔丝元件，以及耦合到熔丝元件的第一和第二引线。 触点焊盘可以延伸到触点元件的部分上并建立与第一和第二引线的电连接。 诸如焊料的导电介质环绕衬底以牢固地形成与引线的机械和电连接。