公开(公告)号：AT354466T

公开(公告)日：2007-03-15

申请号：AT01990176

申请日：2001-12-11

Applicant: CORE TECHNOLOGIES INC C

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  DAVIS WILLIAM E ,  BOHNER RICHARD A

IPC: C08J5/24 ,  B32B5/26 ,  B32B27/04 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  B32B27/12 ,  D03D15/00

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

公开(公告)号：MY143326A

公开(公告)日：2011-04-29

申请号：MYPI20015654

申请日：2001-12-12

Applicant: CORE TECHNOLOGIES INC C

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  DAVIS WILLIAM E ,  BOHNER RICHARD A

IPC: C08J5/24 ,  H05K1/03 ,  B32B5/26 ,  B32B27/04 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

Abstract: PREPREGS, LAMINATES, PRINTED WIRING BOARD STRUCTURES AND PROCESSES FOR CONSTRUCTING MATERIALS AND PRINTED WIRING BOARDS THAT ENABLE THE CONSTRUCTION OF PRINTED WIRING BOARDS WITH IMPROVED THERMAL PROPERTIES. IN ONE EMBODIMENT, THE PREPREGS INCLUDE SUBSTRATES IMPREGNATED WITH ELECTRICALLY AND THERMALLY CONDUCTIVE RESINS. IN OTHER EMBODIMENTS, THE PREPREGS HAVE SUBSTRATE MATERIALS THAT INCLUDE CARBON. IN OTHER EMBODIMENTS, THE PREPREGS INCLUDE SUBSTRATES IMPREGNATED WITH THERMALLY CONDUCTIVE RESINS. IN OTHER EMBODIMENTS, THE PRINTED WIRING BOARD STRUCTURES INCLUDE ELECTRICALLY AND THERMALLY CONDUCTIVE LAMINATES THAT CAN ACT GROUND AND/OR POWER PLANES.

公开(公告)号：DE60126832D1

公开(公告)日：2007-04-05

申请号：DE60126832

申请日：2001-12-11

Applicant: CORE TECHNOLOGIES INC C

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  DAVIS WILLIAM E ,  BOHNER RICHARD A

IPC: B32B5/26 ,  C08J5/24 ,  B32B27/04 ,  B32B27/12 ,  C08K3/38 ,  C08K9/08 ,  D03D15/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.