公开(公告)号：AT354466T

公开(公告)日：2007-03-15

申请号：AT01990176

申请日：2001-12-11

Applicant: CORE TECHNOLOGIES INC C

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  DAVIS WILLIAM E ,  BOHNER RICHARD A

IPC: C08J5/24 ,  B32B5/26 ,  B32B27/04 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  B32B27/12 ,  D03D15/00

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

公开(公告)号：MY143326A

公开(公告)日：2011-04-29

申请号：MYPI20015654

申请日：2001-12-12

Applicant: CORE TECHNOLOGIES INC C

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  DAVIS WILLIAM E ,  BOHNER RICHARD A

IPC: C08J5/24 ,  H05K1/03 ,  B32B5/26 ,  B32B27/04 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

Abstract: PREPREGS, LAMINATES, PRINTED WIRING BOARD STRUCTURES AND PROCESSES FOR CONSTRUCTING MATERIALS AND PRINTED WIRING BOARDS THAT ENABLE THE CONSTRUCTION OF PRINTED WIRING BOARDS WITH IMPROVED THERMAL PROPERTIES. IN ONE EMBODIMENT, THE PREPREGS INCLUDE SUBSTRATES IMPREGNATED WITH ELECTRICALLY AND THERMALLY CONDUCTIVE RESINS. IN OTHER EMBODIMENTS, THE PREPREGS HAVE SUBSTRATE MATERIALS THAT INCLUDE CARBON. IN OTHER EMBODIMENTS, THE PREPREGS INCLUDE SUBSTRATES IMPREGNATED WITH THERMALLY CONDUCTIVE RESINS. IN OTHER EMBODIMENTS, THE PRINTED WIRING BOARD STRUCTURES INCLUDE ELECTRICALLY AND THERMALLY CONDUCTIVE LAMINATES THAT CAN ACT GROUND AND/OR POWER PLANES.

公开(公告)号：DE60126832D1

公开(公告)日：2007-04-05

申请号：DE60126832

申请日：2001-12-11

Applicant: CORE TECHNOLOGIES INC C

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  DAVIS WILLIAM E ,  BOHNER RICHARD A

IPC: B32B5/26 ,  C08J5/24 ,  B32B27/04 ,  B32B27/12 ,  C08K3/38 ,  C08K9/08 ,  D03D15/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

公开(公告)号：WO2006024009A3

公开(公告)日：2007-06-21

申请号：PCT/US2005030277

申请日：2005-08-24

Applicant: CORE TECHNOLOGIES INC C ,  VASOYA KALU K ,  MANGROLIA BHARAT M ,  ROY DON

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  ROY DON

IPC: H05K1/00 ,  H05K7/20

CPC classification number: H05K9/0039 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3677 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/403 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H01L2224/0401

Abstract: Printed wiring board assemblies are described that include printed wiring boards having at least one thermally conductive plane. In addition, the printed wiring boards can also include edge plating on at least a portion of an edge of the printed wiring board. The printed wiring boards can also include heat spreaders, heat sinks and/or thermally conductive heat paths to dissipate heat from the printed wiring board assembly. In many instances, the heat spreaders include microfoils. In one embodiment, the invention includes at least one circuit layer, at least one dielectric layer, at least one thermally conductive plane and edge plating that conducts the at least one thermally conductive plane.

Abstract translation: 描述了印刷线路板组件，其包括具有至少一个导热平面的印刷线路板。 此外，印刷电路板还可以包括在印刷线路板的边缘的至少一部分上的边缘电镀。 印刷线路板还可以包括散热器，散热器和/或导热热路径，以从印刷线路板组件散发热量。 在许多情况下，散热器包括微型薄片。 在一个实施例中，本发明包括至少一个电路层，至少一个介电层，至少一个导热平面和边缘电镀，其传导至少一个导热平面。

公开(公告)号：WO2006099554A3

公开(公告)日：2009-04-16

申请号：PCT/US2006009597

申请日：2006-03-15

Applicant: CORE TECHNOLOGIES INC C ,  VASOYA KALU K

Inventor： VASOYA KALU K

IPC: H05K3/30

CPC classification number: H05K3/4641 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/4638 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2203/056 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T156/1062

Abstract: Processes for manufacturing printed wiring boards including electrically conductive constraining cores are disclosed. Several of the processes enable precise alignment of tooling holes used by tools to perform processes with respect to various panels and subassemblies used to form finished printed wiring boards. Modifications to Gerber files that can increase manufacturing yield and provide the ability to detect faulty printed wiring boards in a panelized array of printed wiring 'boards are also discussed. One embodiment of the invention includes aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references and forming tooling holes in the panel of electrically conductive material.

Abstract translation: 公开了用于制造包括导电约束芯的印刷线路板的工艺。 几个过程使得工具使用的工具孔能够精确地对准用于对用于形成成品印刷线路板的各种面板和子组件进行处理。 还讨论了对Gerber文件的修改，可以提高制造成本并提供检测印刷线路板的面板阵列中的有缺陷的印刷线路板的能力。 本发明的一个实施例包括使用至少一对参考物并使导电材料面板中的工具孔对准编织的导电材料编织板相对于工具表面的织物。