公开(公告)号：WO2017192834A1

公开(公告)日：2017-11-09

申请号：PCT/US2017/031029

申请日：2017-05-04

Applicant: CORNELL UNIVERSITY

Inventor： LAL, Amit ,  SCHENKEL, Thomas ,  PERSAUD, Arun ,  JI, Qing ,  SEIDL, Peter ,  WALDRON, Will ,  ARDANUC, Serhan ,  KADAYRA BASAVARAJAPPA, Vinaya, Kumar

IPC: H05H13/00 ,  H05H7/08

CPC classification number: H05H7/22 ,  H05H7/02 ,  H05H7/08 ,  H05H9/04 ,  H05H13/00 ,  H05H2007/025 ,  H05H2007/045

Abstract: A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.

Abstract translation: 基于晶片的带电粒子加速器包括带电粒子源和至少一个RF带电粒子加速器晶片子组件以及耦合到所述至少一个RF带电粒子加速器晶片子组件的电源 。 基于晶片的带电粒子加速器可以进一步包括射束电流传感器。 基于晶片的带电粒子加速器还可以包括至少第二RF带电粒子加速器晶片子组件和至少一个ESQ带电粒子聚焦晶片。 针对RF带电粒子加速器晶片子组件，ESQ带电粒子聚焦晶片和基于晶片的带电粒子加速器公开了制造方法。