시트와 캐리어의 결합을 위한 물품 및 방법
    2.
    发明公开
    시트와 캐리어의 결합을 위한 물품 및 방법 审中-公开
    用于组合片材和载体的物品和方法

    公开(公告)号:KR20180008644A

    公开(公告)日:2018-01-24

    申请号:KR20177036039

    申请日:2016-05-17

    Applicant: CORNING INC

    CPC classification number: B32B17/06 B32B7/06 C03C17/30 C03C27/10

    Abstract: 시트와캐리어사이의반 데르발스, 수소및 공유결합을제어하기위해시트, 캐리어, 또는이들둘 다에적용될수 있는유기실리콘개질층 및연관된침착방법및 불활성기체처리가본원에기재된다. 개질층은고온가공에서영구적결합이방지될뿐만아니라고온가공동안층간박리를방지하기에충분한결합을유지하도록시트및 캐리어를함께결합시킨다.

    Abstract translation: 本文描述了可以应用于片材,载体或两者以控制片材和载体之间的范德华力,氢和共价键的有机硅改性层和相关的沉积方法以及惰性气体处理。 改性层将片材和载体粘合在一起,以保持足够的粘合以防止热加工期间的分层,并且防止高温加工期间的分层。

    DEVICE MODIFIED SUBSTRATE ARTICLE AND METHODS FOR MAKING

    公开(公告)号:SG11201608442TA

    公开(公告)日:2016-11-29

    申请号:SG11201608442T

    申请日:2015-04-07

    Applicant: CORNING INC

    Abstract: A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including:treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having:silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein;contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate;modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; andseparating the device substrate having the device modified second surface from the glass carrier substrate.

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