公开(公告)号：SG11201804149RA

公开(公告)日：2018-06-28

申请号：SG11201804149R

申请日：2016-11-18

Applicant: CORNING INC

Inventor： ADIB KAVEH ,  CHANG THERESA ,  LI CHENG-CHUNG ,  LIN JEN-CHIEH ,  MAZUMDER PRANTIK ,  TSENG PEI-LIEN

IPC: C03C23/00 ,  B32B7/06 ,  B32B17/06 ,  C03C27/06

Abstract: Described herein are substrates, sheets, or both having a residual surfactant that may be applied thereto to control van der Waals, hydrogen and covalent bonding between the substrate and the sheet. The sheet and substrate are bonded together such that a permanent bond is prevented during high temperature processing but while maintaining a sufficient bond to prevent delamination during the high temperature processing. The substrate and sheet remain debondable through-out and subsequent to the high temperature processing.

公开(公告)号：WO2013119737A3

公开(公告)日：2014-02-27

申请号：PCT/US2013025035

申请日：2013-02-07

Applicant: CORNING INC ,  ABRAMOV ANATOLI ANATOLYEVICH ,  BELLMAN ROBERT ALAN ,  BOOKBINDER DANA CRAIG ,  CHUANG TA-KO ,  DOMEY JEFFREY JOHN ,  ENICKS DARWIN GENE ,  GASKILL LINDA ,  KANG KIAT CHYAI ,  KEMMERER MARVIN WILLIAM ,  KUO KUAN-TING ,  LIN JEN-CHIEH ,  MANLEY ROBERT GEORGE ,  THOMAS JOHN CHRISTOPHER ,  TSENG PEI-LIEN ,  ZHANG JIAN-ZHI JAY

Inventor： ABRAMOV ANATOLI ANATOLYEVICH ,  BELLMAN ROBERT ALAN ,  BOOKBINDER DANA CRAIG ,  CHUANG TA-KO ,  DOMEY JEFFREY JOHN ,  ENICKS DARWIN GENE ,  GASKILL LINDA ,  KANG KIAT CHYAI ,  KEMMERER MARVIN WILLIAM ,  KUO KUAN-TING ,  LIN JEN-CHIEH ,  MANLEY ROBERT GEORGE ,  THOMAS JOHN CHRISTOPHER ,  TSENG PEI-LIEN ,  ZHANG JIAN-ZHI JAY

IPC: H01L21/50

CPC classification number: C03C27/10 ,  B23K26/40 ,  B23K2203/50 ,  B32B7/06 ,  B32B17/06 ,  B65G2249/02 ,  C03B33/07 ,  C03B33/091

Abstract: A method of removing a desired part of a thin sheet (20) from a thin sheet bonded to a carrier (10) by a bonded area (40) that surrounds a non-bonded area (50), wherein the method includes forming a perimeter vent (60) defining a perimeter of the desired part (56), wherein the perimeter vent is disposed within the non-bonded area and has a depth >= 50% of the thickness (22) of the thin sheet. Prior to removing the desired part, a device may be processed onto the thin sheet. In some processes, the carrier is diced so it may be processed in smaller sizes, yet maintains a hermetically sealed edge. After dicing, an additional part of the device may be processed onto the thin sheet, and the desired part is removed by removing a desired part of the thin sheet from the carrier.

Abstract translation: 一种从通过围绕非接合区域（50）的接合区域（40）从结合到载体（10）的薄片去除薄片（20）的期望部分的方法，其中所述方法包括形成周边 限定所需部分（56）的周边的排气口（60），其中所述周边通气口设置在所述非接合区域内，并且具有所述薄片厚度（22）的深度> = 50％。 在去除期望的部件之前，可以在薄片上处理装置。 在一些工艺中，载体被切割，因此可以以较小的尺寸加工，同时保持密封的边缘。 在切割之后，可以将另一部分装置加工到薄片上，并通过从载体上移除所需薄片的一部分来除去所需的部分。

公开(公告)号：WO2011149804A3

公开(公告)日：2012-01-12

申请号：PCT/US2011037496

申请日：2011-05-23

Applicant: CORNING INC ,  HE MINGQIAN ,  LI JIANFENG ,  LIN JEN-CHIEH ,  MATTHEWS JAMES R ,  NIU WEIJUN ,  SORENSEN MICHAEL L

Inventor： HE MINGQIAN ,  LI JIANFENG ,  LIN JEN-CHIEH ,  MATTHEWS JAMES R ,  NIU WEIJUN ,  SORENSEN MICHAEL L

IPC: C08L65/00 ,  C09D11/00 ,  H01B1/12

CPC classification number: C09D11/36 ,  C08G2261/124 ,  C08G2261/141 ,  C08G2261/3223 ,  C08G2261/3243 ,  C08G2261/92 ,  C08K5/01 ,  C08L65/00

Abstract: A formulation including: an organic semiconducting material; and a carrier liquid including at least one of: a first liquid of the formulas (III) or (II), or mixtures of formulas (III) and (II); and a second liquid of a saturated or unsaturated cyclic hydrocarbylene compound of the formula (I) where the respective R1-8, x, and n are as defined herein, and optionally a tertiary liquid carrier, as defined herein. Also disclosed are semiconducting articles prepared with the formulations as defined herein.

Abstract translation: 一种制剂，包括：有机半导体材料; 和包含以下至少一种的载体液体：式（III）或（II）的第一液体，或式（III）和（II）的混合物; 和其中相应的R1-8，x和n如本文所定义的式（I）的饱和或不饱和环亚烃基化合物的第二液体，以及任选的如本文所定义的第三液体载体。 还公开了用本文定义的制剂制备的半导体制品。