公开(公告)号：JP2003202664A

公开(公告)日：2003-07-18

申请号：JP2002248319

申请日：2002-08-28

Applicant: CORNING INC

Inventor： BRADY MICHAEL D ,  CUSTER MARTHA B ,  GUERMEUR CELINE C ,  PETERSON RICHARD C ,  SHARE CHRISTINE M

IPC: G01N33/53 ,  B01L3/02 ,  B81C1/00 ,  C40B40/06 ,  C40B60/14 ,  G01N37/00 ,  G03F7/004 ,  G03F7/40

Abstract: PROBLEM TO BE SOLVED: To provide a pin plate and a method for making the pin plate by which control and reproduction are possible and costs are not increased. SOLUTION: The pin plate is used to print a high density array printing of materials such as biological inks, and the method is for manufacturing the pin plate. The pin plate can be manufactured by coating a top surface of a silica wafer with a substantially thick layer of photoresist material. Next, a photolithography process is used to remove selected areas of the photoresist material from the silica wafer. Thereafter, a reactive ion etching process is used to form the pins in the silica wafer by etching away a predetermined amount of the top surface from the silica wafer that is not covered by the photoresist material. Afterwards, the remaining photoresist material is removed from the silica wafer which now resembles the pin plate. COPYRIGHT: (C)2003,JPO