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公开(公告)号:JP2001077065A
公开(公告)日:2001-03-23
申请号:JP2000228833
申请日:2000-07-28
Applicant: CORNING INC
Inventor: DARCANGELO CHARLES M , SABIA ROBERT , STEVENS HARRIE JAMES
IPC: B24B37/00 , C09K3/14 , H01L21/302 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To make smooth the surface of a silica substrate in a method to finally polish the silica substrate. SOLUTION: The method to finally polish a silica substrate comprises a process to provide the silica substrate, a process wherein first the surface of the substrate is polished using an aqueous solution containing at least one kind of a metallic oxide polishing agent and the surface roughness Ra of the substrate is set in the range of about 6 to 10 Å, and moreover, a process wherein the surface of the substrate is polished using an alkailne aqueous solution containing a colloidal silica of a particle diameter of 500 nm or shorter to set the surface roughness Ra in the range of 5 Å or shorter.
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公开(公告)号:JP2001085371A
公开(公告)日:2001-03-30
申请号:JP2000228832
申请日:2000-07-28
Applicant: CORNING INC
Inventor: SABIA ROBERT , STEVENS HARRIE JAMES
IPC: B24B37/00 , C03C19/00 , C09G1/02 , C09K3/14 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To accelerate removing speed by reducing damages on a surface to be polished, in a method for finish polishing a silica substrate. SOLUTION: A method for finish polishing a silica substrate comprises a step of providing the substrate, a step of first polishing the surface of the substrate to a range of surface roughness Ra to 6 to 10 Å by using an aqueous solution containing at least one type of metal oxide abrasive, and a step of further grinding the surface of the substrate to the roughness Ra to about 5 Åor less, by using the aqueous solution containing a colloidal silica soot having a mean particle size of 50 to 500 nm.
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3.
公开(公告)号:EP0782548A4
公开(公告)日:1999-09-22
申请号:EP95929350
申请日:1995-07-26
Applicant: CORNING INC
Inventor: STEVENS HARRIE JAMES
CPC classification number: B23K26/0736 , B32B17/064 , C03B33/074 , C03B33/091 , C03C23/0025 , Y10T83/0333
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