POLISHING OF MOLTEN SILICA USING COLLOID

    公开(公告)号:JP2001077065A

    公开(公告)日:2001-03-23

    申请号:JP2000228833

    申请日:2000-07-28

    Applicant: CORNING INC

    Abstract: PROBLEM TO BE SOLVED: To make smooth the surface of a silica substrate in a method to finally polish the silica substrate. SOLUTION: The method to finally polish a silica substrate comprises a process to provide the silica substrate, a process wherein first the surface of the substrate is polished using an aqueous solution containing at least one kind of a metallic oxide polishing agent and the surface roughness Ra of the substrate is set in the range of about 6 to 10 Å, and moreover, a process wherein the surface of the substrate is polished using an alkailne aqueous solution containing a colloidal silica of a particle diameter of 500 nm or shorter to set the surface roughness Ra in the range of 5 Å or shorter.

    GLAZING ABRASIVE FOR COLLOIDAL SILLICA

    公开(公告)号:JP2001085371A

    公开(公告)日:2001-03-30

    申请号:JP2000228832

    申请日:2000-07-28

    Applicant: CORNING INC

    Abstract: PROBLEM TO BE SOLVED: To accelerate removing speed by reducing damages on a surface to be polished, in a method for finish polishing a silica substrate. SOLUTION: A method for finish polishing a silica substrate comprises a step of providing the substrate, a step of first polishing the surface of the substrate to a range of surface roughness Ra to 6 to 10 Å by using an aqueous solution containing at least one type of metal oxide abrasive, and a step of further grinding the surface of the substrate to the roughness Ra to about 5 Åor less, by using the aqueous solution containing a colloidal silica soot having a mean particle size of 50 to 500 nm.

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