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    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF FABRICATION
    3.
    发明专利
    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF FABRICATION 未知

    公开(公告)号：CA2522566A1

    公开(公告)日：2004-11-04

    申请号：CA2522566

    申请日：2004-03-12

    Applicant: CORNING INC

    Inventor： MORENA ROBERT MICHAEL ,  POWLEY MARK LAWRENCE ,  SCHROEDER JOSEPH FRANCIS ,  STRELTSOV ALEXANDER ,  REDDY KAMJULA PATTABHIRAMI

    IPC: C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C8/24 ,  C03C27/00 ,  C03C27/06 ,  C03C27/12 ,  H01L51/00 ,  H01L51/52 ,  H05B33/04

    Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, and/or neodymiu m. A sensitive thin-film device that needs protection is deposited onto the fir st substrate plate. A laser is then used to heat the doped second substrate pla te in a manner that causes a portion of it to swell and form a hermetic seal th at connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass packag e are also described herein.

    Creation of three-dimensional structures using ultrashort low energy laser exposure and structures formed thereby
    4.
    发明专利
    Creation of three-dimensional structures using ultrashort low energy laser exposure and structures formed thereby 未知

    公开(公告)号：AU1198801A

    公开(公告)日：2001-06-12

    申请号：AU1198801

    申请日：2000-10-12

    Applicant: CORNING INC

    Inventor： ALLAN DOUGLAS C ,  BORRELLI NICHOLAS F ,  STRELTSOV ALEXANDER

    IPC: G02B5/20 ,  G02B6/122 ,  G02B27/14 ,  G02B5/23

    Abstract: Use of ultrashort, focused pulses to alter a detectable optical property in a specific region in a structure allows lower energy to be used in fabrication of a three-dimensional, periodic array of altered regions in a material. These properties may be, for example, an index of refraction, absorption or scattering. The typical spacing between altered regions may be larger than a wavelength of interest, to create diffractive optical elements, or may be roughly the same as a wavelength of interest, to create photonic crystal elements. The photonic crystal may have a photonic band gap, i.e., a frequency range in which no modes may propagate, or may simply have altered dispersion properties but no gap, as in a photonic crystal superprism.

    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF FABRICATION
    6.
    发明申请
    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF FABRICATION 审中-公开
    密封玻璃包装和制造方法

    公开(公告)号：WO2004094331A3

    公开(公告)日：2005-08-25

    申请号：PCT/US2004007557

    申请日：2004-03-12

    Applicant: REDDY KAMJULA P ,  SCHROEDER JOSEPH F ,  STRELTSOV ALEXANDER ,  POWLEY MARK L ,  MORENA ROBERT M ,  CORNING INC

    Inventor： REDDY KAMJULA P ,  SCHROEDER JOSEPH F ,  STRELTSOV ALEXANDER ,  POWLEY MARK L ,  MORENA ROBERT M

    IPC: C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C8/24 ,  C03C27/00 ,  C03C27/06 ,  C03C27/12 ,  H01L51/00 ,  H01L51/52 ,  H05B33/04

    CPC classification number: C03C8/24 ,  C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C27/06 ,  H01L51/524 ,  H01L51/5246

    Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, and/or neodymium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

    Abstract translation: 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 在一个实施例中，通过提供第一基板和第二基板制造密封的玻璃封装。 第二衬底含有至少一种过渡金属，例如铁，铜，钒，锰，钴，镍，铬和/或钕。 需要保护的敏感薄膜器件沉积到第一衬底板上。 然后使用激光器以使其一部分膨胀并形成将第一衬底板连接到第二衬底板的气密密封件并且还保护薄膜器件的方式来加热掺杂的第二衬底板。 第二衬底板掺杂有至少一种过渡金属，使得当激光与其相互作用时，吸收来自第二衬底板中的激光的光，这导致气密密封的形成，同时避免对 薄膜装置。 这里还描述了密封玻璃封装的另一个实施例和用于制造密封玻璃封装的方法。

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