公开(公告)号：CA2859778A1

公开(公告)日：2013-07-11

申请号：CA2859778

申请日：2012-11-01

Applicant: CRAY INC

Inventor： KIM HYUNJUN ,  CONGER JEFFREY SCOTT ,  SCOTT GREGORY ERWIN

IPC: H05K1/02 ,  H05K1/11

Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.

公开(公告)号：EP2801123A4

公开(公告)日：2015-10-21

申请号：EP12864500

申请日：2012-11-01

Applicant: CRAY INC

Inventor： KIM HYUNJUN ,  CONGER JEFFREY SCOTT ,  SCOTT GREGORY ERWIN

IPC: H05K1/02 ,  H01R12/57

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165