公开(公告)号：WO2013148573A1

公开(公告)日：2013-10-03

申请号：PCT/US2013/033704

申请日：2013-03-25

Applicant: CREE, INC.

Inventor： HUSSELL, Christopher, P. ,  ANDREW, Peter, Scott ,  TUDORICA, Florin, A. ,  WELCH, Erin

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49227 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management.

Abstract translation: 公开了包含一个或多个发光器件（例如发光二极管（LED）或LED芯片）的器件，部件和方法。 在一个方面，光发射器件部件可以包括具有顶表面的陶瓷体，直接或间接安装在顶表面上的一个或多个发光器件，以及安装在顶表面上并电耦合到 一个或多个光发射器件，其中一个或多个电气部件可以通过一个或多个非金属层与陶瓷体间隔开。 本文公开的组件可以导致改进的光提取和热管理。

公开(公告)号：WO2016176625A1

公开(公告)日：2016-11-03

申请号：PCT/US2016/030211

申请日：2016-04-29

Applicant: CREE, INC.

Inventor： TUDORICA, Florin, A. ,  HUSSELL, Christopher, P. ,  DURKEE, John, Wesley ,  ANDREWS, Peter, Scott ,  CASH, Mark ,  RANDOLPH, David

IPC: F21K99/00 ,  F21V13/04 ,  F21V29/506 ,  F21V13/02 ,  F21V17/14

CPC classification number: F21K9/66 ,  F21K9/60 ,  F21K9/62 ,  F21K9/68 ,  F21V3/00 ,  F21V7/00 ,  F21V9/30 ,  F21V13/02 ,  F21V17/14 ,  F21V23/003 ,  F21V23/005 ,  F21V23/008 ,  F21V29/506 ,  F21V29/76 ,  F21V29/777 ,  F21V29/83 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30

Abstract: Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate (12) comprising a light emitter surface (LES) and or more light emitters (14) disposed on and/or over the light emitter surface (LES). Exemplary components include a light directing optic (R) and/or a diffusing optic (D) for mixing light. The light directing optic (R) may be disposed at least partially around a perimeter of the light emitter surface (LES). The diffusing optic (D) may be disposed between portions of the light directing optic (R) and spaced apart from the light emitter surface (LES).

Abstract translation: 固态照明组件具有改进的显色性，改进的颜色均匀性和改进的定向照明，并且适用于高输出照明应用，可用于代替CDMH灯泡照明。 示例性的固态照明部件包括基板（12），其包括设置在光发射器表面（LES）上和/或上方的光发射器表面（LES）和或更多个发光体（14）。 示例性组件包括用于混合光的导光光学器件（R）和/或漫射光学器件（D）。 光导光学元件（R）可以至少部分地围绕光发射器表面（LES）的周边设置。 扩散光学器件（D）可以设置在光导光学元件（R）的部分之间并且与光发射器表面（LES）间隔开。

公开(公告)号：WO2015035181A1

公开(公告)日：2015-03-12

申请号：PCT/US2014/054314

申请日：2014-09-05

Applicant: CREE, INC.

Inventor： HUSSELL, Christopher, P. ,  REIHERZER, Jesse, Colin ,  WELCH, Erin, R., F. ,  TUDORICA, Florin, A.

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/62

CPC classification number: F21V7/22 ,  F21K9/60 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0588 ,  H01L2924/00

Abstract: Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (LED) chips and can include providing a substrate, a conductive trace over the substrate, and at least one or more direct attach LED chip over the substrate. A layer of non-conductive and reflective material is disposed over the surface of wherein the layer of reflective material covers at least 25% or more of a surface of the substrate.

Abstract translation: 本文提供了发光器件和方法。 在一些方面，本文提供的发射器件和方法用于发光二极管（LED）芯片，并且可以包括提供衬底，衬底上的导电迹线以及衬底上的至少一个或多个直接附接LED芯片。 非导电和反射材料层设置在其上的反射材料层覆盖基底表面的至少25％或更多的表面上。

公开(公告)号：EP3289281A1

公开(公告)日：2018-03-07

申请号：EP16724776.6

申请日：2016-04-29

Applicant: Cree, Inc.

Inventor： TUDORICA, Florin, A. ,  HUSSELL, Christopher, P. ,  DURKEE, John, Wesley ,  ANDREWS, Peter, Scott ,  CASH, Mark ,  RANDOLPH, David

IPC: F21K99/00 ,  F21V13/04 ,  F21V29/506 ,  F21V13/02 ,  F21V17/14

CPC classification number: F21K9/66 ,  F21K9/60 ,  F21K9/62 ,  F21K9/68 ,  F21V3/00 ,  F21V7/00 ,  F21V9/30 ,  F21V13/02 ,  F21V17/14 ,  F21V23/003 ,  F21V23/005 ,  F21V23/008 ,  F21V29/506 ,  F21V29/76 ,  F21V29/777 ,  F21V29/83 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30

Abstract: Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.