公开(公告)号：DE2362567A1

公开(公告)日：1975-06-19

申请号：DE2362567

申请日：1973-12-17

Applicant: CRL ELECTRONIC BAUELEMENTE

Inventor： SCHUERMANN WALTER DIPL ING ,  GOETZE HANS CHRISTOPH DIPL PHY

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K7/20

Abstract: The components are mounted on an insulating board and interconnected by conducting traces. In addition to the circuit proper one or several temp.-sensitive resistors are provided on the board surface, which thermally affect the circuit components. The insulating board consists of hardboard or plastic impregnated with synthetic resin, and the temp.-sensitive resistors are separate units. Alternatively the insulating board consists of glass or ceramic, the active components are discrete units and passive components are produced by the thick or thin film method. The temp.-sensitive resistors are discrete units, or are made by the film method.