公开(公告)号：US08420951B2

公开(公告)日：2013-04-16

申请号：US13162547

申请日：2011-06-16

Applicant: Shih-Hao Sun ,  Chang-Fu Chen

Inventor： Shih-Hao Sun ,  Chang-Fu Chen

IPC: H05K3/00

CPC classification number: H01L21/563 ,  H01L21/4821 ,  H01L21/568 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A manufacturing method of a package structure is provided. In the manufacturing method, a metal substrate having a seed layer is provided. A patterned circuit layer is formed on a portion of the seed layer. A first patterned dry film layer is formed on the other portion of the seed layer. A surface treatment layer is electroplated on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask. The first patterned dry film layer is removed. A chip bonding process is performed to electrically connect a chip to the surface treatment layer. An encapsulant is formed on the metal substrate. The encapsulant encapsulates the chip, the surface treatment layer, and the patterned circuit layer. The metal substrate and the seed layer are removed to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.

Abstract translation: 提供一种封装结构的制造方法。 在制造方法中，提供具有种子层的金属基板。 在种子层的一部分上形成图案化电路层。 第一图案化的干膜层形成在种子层的另一部分上。 使用第一图案化的干膜层作为电镀掩模，在图案化电路层上电镀表面处理层。 去除第一图案干膜层。 执行芯片接合工艺以将芯片电连接到表面处理层。 在金属基板上形成密封剂。 密封剂封装芯片，表面处理层和图案化电路层。 除去金属基底和种子层以露出密封剂的底表面和图案化电路层的下表面。

公开(公告)号：US07964106B2

公开(公告)日：2011-06-21

申请号：US12129689

申请日：2008-05-30

Applicant: Chang-Fu Chen

Inventor： Chang-Fu Chen

IPC: H01B13/00 ,  H01L21/00

CPC classification number: H01L21/6835 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/81136 ,  H01L2224/81801 ,  H05K3/06 ,  H05K3/20 ,  H05K3/4007 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2203/0353 ,  H05K2203/0384 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: A method of fabricating a packaging substrate is disclosed. A cladding sheet comprised of a first metal foil, a second metal foil and an etch stop layer interposed between the first and second metal foils is provided. The first metal foil is then patterned into a first circuit trace. An insulating layer is laminated onto the first circuit trace. Thereafter, the second metal foil is patterned into a plurality of bump pads. The etch stop layer that is not covered by the bump pads is stripped off. A solder mask is applied to fill the spacing between the bump pads. A top surface of each of the bump pads is etched to form a bonding aperture in a self-aligned fashion.

Abstract translation: 公开了一种制造封装衬底的方法。 提供由第一金属箔，第二金属箔和介于第一和第二金属箔之间的蚀刻停止层构成的覆层片。 然后将第一金属箔图案化成第一电路迹线。 绝缘层被层压到第一电路迹线上。 此后，将第二金属箔图案化成多个凸块焊盘。 剥离不被凸块焊接的蚀刻停止层被剥离。 施加焊接掩模以填充凸块之间的间隔。 每个凸块焊盘的顶表面被蚀刻以自对准的方式形成接合孔。

公开(公告)号：US20090064456A1

公开(公告)日：2009-03-12

申请号：US11853869

申请日：2007-09-12

Applicant: Chang-Fu Chen

Inventor： Chang-Fu Chen

IPC: A45C13/00

CPC classification number: A45C13/385 ,  A45C5/14 ,  Y10T16/451

Abstract: A towing handle assembly for a luggage carrier includes a fixing member having a magnet mounted thereto. The fixing member includes at least one groove formed thereon. At least one telescoping member is received in the respective at least one groove. The telescoping member includes a magnet mounted thereto.

Abstract translation: 用于行李架的牵引手柄组件包括具有安装在其上的磁体的固定构件。 固定构件包括形成在其上的至少一个凹槽。 至少一个伸缩构件被容纳在相应的至少一个凹槽中。 伸缩构件包括安装在其上的磁体。

公开(公告)号：USD577490S1

公开(公告)日：2008-09-30

申请号：US29296905

申请日：2007-10-31

Applicant: Chang-Fu Chen

Designer： Chang-Fu Chen

公开(公告)号：US07135642B2

公开(公告)日：2006-11-14

申请号：US10946929

申请日：2004-09-21

Applicant: C. F. Wang ,  Chang-Fu Chen

Inventor： C. F. Wang ,  Chang-Fu Chen

IPC: H01R12/04

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An integrated circuit carrier with conductive rings and a semiconductor device integrated with the carrier are proposed. A plurality of concave structures are formed on the conductive rings at predetermined positions above which a plurality of wires traverse, the wires being provided for electrically connecting the carrier to a semiconductor chip mounted on the carrier. Therefore, an insulating effect between the wires and the conductive rings is provided to prevent short circuit, so as to maintain the performance of the semiconductor device.

Abstract translation: 提出了一种具有导电环的集成电路载体和与载体集成的半导体器件。 在导电环上形成多个凹形结构，该预定位置在多个电线穿过其上方的预定位置处，所述导线被设置用于将载体电连接到安装在载体上的半导体芯片。 因此，提供导线与导电环之间的绝缘效果以防止短路，从而保持半导体器件的性能。

公开(公告)号：US20130095615A1

公开(公告)日：2013-04-18

申请号：US13692971

申请日：2012-12-03

Applicant: Shih-Hao Sun ,  Chang-Fu Chen

Inventor： Shih-Hao Sun ,  Chang-Fu Chen

IPC: H01L21/56

CPC classification number: H01L21/563 ,  H01L21/4821 ,  H01L21/568 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A manufacturing method of a package structure is provided. In the manufacturing method, a metal substrate having a seed layer is provided. A patterned circuit layer is formed on a portion of the seed layer. A first patterned dry film layer is formed on the other portion of the seed layer. A surface treatment layer is electroplated on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask. The first patterned dry film layer is removed. A chip bonding process is performed to electrically connect a chip to the surface treatment layer. An encapsulant is formed on the metal substrate. The encapsulant encapsulates the chip, the surface treatment layer, and the patterned circuit layer. The metal substrate and the seed layer are removed to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.

Abstract translation: 提供一种封装结构的制造方法。 在制造方法中，提供具有种子层的金属基板。 在种子层的一部分上形成图案化电路层。 第一图案化的干膜层形成在种子层的另一部分上。 使用第一图案化干膜层作为电镀掩模，在图案化电路层上电镀表面处理层。 去除第一图案干膜层。 执行芯片接合工艺以将芯片电连接到表面处理层。 在金属基板上形成密封剂。 密封剂封装芯片，表面处理层和图案化电路层。 除去金属基底和种子层以露出密封剂的底表面和图案化电路层的下表面。

公开(公告)号：US20070035655A1

公开(公告)日：2007-02-15

申请号：US11200089

申请日：2005-08-10

Applicant: Chang-Fu Chen ,  Chih-Ming Huang ,  Yi-Cheng Su ,  Chien-Cheng Chen ,  Chih-Hao Chen ,  Tomas-Gavin Melia

Inventor： Chang-Fu Chen ,  Chih-Ming Huang ,  Yi-Cheng Su ,  Chien-Cheng Chen ,  Chih-Hao Chen ,  Tomas-Gavin Melia

IPC: H04N5/225

CPC classification number: H04N1/04 ,  H04N2201/0081 ,  H04N2201/0436 ,  H04N2201/0446 ,  H04N2201/045

Abstract: A multi-functional scanning camera comprises a rear cover; a front cover combined to the rear cover; a main back casing; a left telescopic rod; a right telescopic rod; a left fixing unit and a right fixing unit locked to two sides of the back casing; a main front casing assembled to a main back casing; and a lower side of a rear end of the main back casing being installed with a left rotary retaining seat and a right rotary retaining seat. The scanning operation will not affect the operation of network operation. The scanner is extendable and foldable. The plurality of light emitting diodes serves to illuminate the documents located below and the adjusting button serves to adjust the illumination so that the words on the document are shown clearly.

Abstract translation: 多功能扫描照相机包括后盖; 一个前盖组合在后盖上; 主后套 左伸缩杆 右伸缩杆 左固定单元和右固定单元，锁定在后壳的两侧; 组装到主后壳的主前壳; 并且主后壳的后端的下侧安装有左旋转保持座和右旋转保持座。 扫描操作不会影响网络运行。 扫描仪是可扩展和可折叠的。 多个发光二极管用于照亮位于下方的文件，并且调节按钮用于调节照明，使得文档上的单词被清楚地示出。

公开(公告)号：US06509636B1

公开(公告)日：2003-01-21

申请号：US10039251

申请日：2002-01-02

Applicant: Yueh-Ying Tsai ,  Chin-Yuan Hung ,  Chang-Fu Chen

Inventor： Yueh-Ying Tsai ,  Chin-Yuan Hung ,  Chang-Fu Chen

IPC: H01L2302

CPC classification number: H01L23/10 ,  H01L27/14618 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/16315 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A photosensitive semiconductor package with a lid is proposed, in which a chip carrier is formed with an encapsulant thereon, and the encapsulant is formed with a cavity for exposing a semiconductor chip mounted on the chip carrier. A top of the encapsulant is structured with a groove and at least a beveled portion that descends toward the groove and is associated with the groove. When a lid is attached onto the encapsulant by using an adhesive, the groove can temporarily retain excess adhesive with its flow being directed toward the groove by the beveled portion, so that undersirable adhesive loss and adhesive flash can both be prevented from occurrence, allowing the appearance of the semiconductor package to be well maintained.

Abstract translation: 提出了具有盖的光敏半导体封装，其中在其上形成有密封剂的芯片载体，并且密封剂形成有用于暴露安装在芯片载体上的半导体芯片的空腔。 密封剂的顶部被构造成具有凹槽和至少一个倾斜的部分，该斜面部分朝着凹槽下降并与凹槽相关联。 当通过使用粘合剂将盖子附着到密封剂上时，槽可以暂时保留多余的粘合剂，其流动通过倾斜部分指向凹槽，使得可以防止不希望的粘合剂损失和粘合剂闪光发生，从而允许 半导体封装的外观要保持良好。

公开(公告)号：US06396129B1

公开(公告)日：2002-05-28

申请号：US09800361

申请日：2001-03-05

Applicant: Chin-Yuan Hung ,  Chang-Fu Chen ,  Fu-Di Tang

Inventor： Chin-Yuan Hung ,  Chang-Fu Chen ,  Fu-Di Tang

IPC: H01L23495

CPC classification number: H01L24/32 ,  H01L23/49503 ,  H01L23/49513 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A leadframe with a dot array of silver-plated regions on die pad is proposed, which is designed specifically for use in the construction of an exposed-pad type of semiconductor package. The proposed leadframe is characterized by that the front side of the die pad is partitioned into a centrally-located die-mounting area and a peripherally-located ground-wire bonding area; and wherein the die-mounting area is selectively silver-plated to form a dot array of silver-plated regions, while the peripheral area of the die pad is entirely silver-plated to form a silver-plated peripheral area. In addition, the die-mounting area of the die pad can be further formed with a plurality of dimples for the purpose of increasing the contact area between the die pad and a silver-epoxy layer that is to be pasted over the die-mounting area for use to adhere a semiconductor chip to the die pad. Owing to the provision of the dot array of silver-plated regions within the die-mounting area, it allows a better electrical coupling between the die pad and the inactive surface of the semiconductor chip than the conventional ring plating scheme so that the packaged semiconductor chip can have a better grounding effect, and also allows the silver-epoxy layer to be better adhered to the die pad than the conventional spotted plating scheme to prevent delamination.

Abstract translation: 提出了一种引线框架，其具有在芯片焊盘上的镀银区域的阵列阵列，其被专门设计用于暴露焊盘型半导体封装的构造。 所提出的引线框架的特征在于，芯片焊盘的前侧被分隔成中心定位的管芯安装区域和位于外围的接地引线接合区域; 并且其中，所述管芯安装区域被选择性地镀银以形成镀银区域的点阵列，同时所述管​​芯焊盘的周边区域被完全镀银以形成镀银周边区域。 此外，芯片焊盘的管芯安装区域可以进一步形成有多个凹坑，目的是增加管芯焊盘和待粘贴在管芯安装区域上的银环氧树脂层之间的接触面积 用于将半导体芯片粘附到管芯焊盘。 由于在芯片安装区域内设置镀银区域的点阵列，所以允许芯片焊盘和半导体芯片的非活性表面之间的电气耦合比传统的环形电镀方案更好地电连接，使得封装的半导体芯片 可以具有更好的接地效果，并且还允许银环氧树脂层比常规的点电镀方案更好地粘附到芯片焊盘，以防止分层。

公开(公告)号：US08893379B2

公开(公告)日：2014-11-25

申请号：US13692971

申请日：2012-12-03

Applicant: Shih-Hao Sun ,  Chang-Fu Chen

Inventor： Shih-Hao Sun ,  Chang-Fu Chen

IPC: H05K3/30 ,  H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/563 ,  H01L21/4821 ,  H01L21/568 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A manufacturing method of a package structure is provided. In the manufacturing method, a metal substrate having a seed layer is provided. A patterned circuit layer is formed on a portion of the seed layer. A first patterned dry film layer is formed on the other portion of the seed layer. A surface treatment layer is electroplated on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask. The first patterned dry film layer is removed. A chip bonding process is performed to electrically connect a chip to the surface treatment layer. An encapsulant is formed on the metal substrate. The encapsulant encapsulates the chip, the surface treatment layer, and the patterned circuit layer. The metal substrate and the seed layer are removed to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.

Abstract translation: 提供一种封装结构的制造方法。 在制造方法中，提供具有种子层的金属基板。 在种子层的一部分上形成图案化电路层。 第一图案化的干膜层形成在种子层的另一部分上。 使用第一图案化干膜层作为电镀掩模，在图案化电路层上电镀表面处理层。 去除第一图案干膜层。 执行芯片接合工艺以将芯片电连接到表面处理层。 在金属基板上形成密封剂。 密封剂封装芯片，表面处理层和图案化电路层。 除去金属基底和种子层以露出密封剂的底表面和图案化电路层的下表面。