公开(公告)号：US20220157639A1

公开(公告)日：2022-05-19

申请号：US17521952

申请日：2021-11-09

Applicant: Chroma Ate Inc.

Inventor： CHIEN-MING CHEN ,  CHIN-YI OUYANG

IPC: H01L21/683 ,  H01L21/677

Abstract: The present invention relates to a chip transfer device capable of floatingly positioning a chip and a method for floatingly positioning a chip. When a chip is placed in a chip socket, a control unit controls an air pressure switching valve to allow at least one vent hole to be communicated with a positive air pressure source. An air flow from the positive air pressure source blows a lower surface of the chip through the vent hole, so that the at least one chip is air-floated. Accordingly, when the chip socket is communicated with the positive air pressure source, the air flow blows the lower surface of the chip in the chip socket through the vent hole, so that the chip is air-floated in the chip socket to reduce the error displacement of the chip offset.

公开(公告)号：US20200057037A1

公开(公告)日：2020-02-20

申请号：US16540162

申请日：2019-08-14

Applicant: Chroma Ate Inc.

Inventor： YUNG-CHIH CHEN ,  CHIEN-MING CHEN ,  YUN-JUI CHENG

IPC: G01N33/00

Abstract: A rotating buffer station for a chip mainly comprises an upper cover plate, a rotatable plate, a movable jaw member and a lower base. The upper cover plate is arranged on the lower base and formed with a guide slot. The rotatable plate is located between the lower base and the upper cover plate and formed with a cam slot. The rotatable plate is pivotally coupled to the lower base. The movable jaw member is slidably engaged with the cam slot and the guide slot. When the rotatable plate is rotated, the cam slot forces the movable jaw member to move radially along the guide slot so as to form a chip socket. Accordingly, with rotation of the rotatable plate, the cam slot forces the movable jaw member to move radially along the guide slot so that the chip socket can be resized to hold various differently-sized chips.

公开(公告)号：MY170414A

公开(公告)日：2019-07-29

申请号：MYPI2013700711

申请日：2013-05-02

Applicant: CHROMA ATE INC

Inventor： CHIEN-MING CHEN ,  MENG-KUNG LU

Abstract: A test device is provided for testing a bottom chip ( 5) of a package-on-package (PoP) stacked-chip. An upper surface (51) of the bottom chip (5) has a plurality of soldering points (511) for electrically connecting a plurality of corresponding soldering points (222) of a top chip (221) of the PoP stacked-chip. The test device includes a test head (22) and a plurality of test contacts (224). The test head (22) has the top chip (221) installed inside. The plurality of test contacts (224)is installed on a lower surface (225) of the test head (22) and electrically connected to the plurality of corresponding soldering points (222) of the top chip (221)inside the test head (22). When the lower surface (225) of the test head (22) contacts the upper surface (51) of the bottom chip (5), the plurality of test contacts (224)is electrically connected to the plurality of soldering points (511) for testing the bottom chip (5). Figure 4

公开(公告)号：SG194333A1

公开(公告)日：2013-11-29

申请号：SG2013033956

申请日：2013-05-02

Applicant: CHROMA ATE INC

Inventor： CHIEN-MING CHEN ,  MENG-KUNG LU

Abstract: A test device is provided for testing a bottom chip of a package-on package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts isinstalled on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.