公开(公告)号：WO2018149463A2

公开(公告)日：2018-08-23

申请号：PCT/DK2018/050034

申请日：2018-02-20

Applicant: COLOPLAST A/S

Inventor： SUND, Anders Grove ,  STROEBECH, Esben ,  LANGHORN, Philip Holler ,  SLETTEN, Carsten ,  HOEJSTROEM, Michael

IPC: A61F5/445

Abstract: An adhesive wafer for an ostomy device, the wafer comprising a first adhesive layer, a backing layer on the distal side of the first adhesive layer, a second skin facing adhesive layer and a hole for accommodating a stoma. Embedded between the adhesive layers is a release layer capable of releasing a neutralizing compound to the peristomal skin.

公开(公告)号：WO2018149463A3

公开(公告)日：2018-08-23

申请号：PCT/DK2018/050034

申请日：2018-02-20

Applicant: COLOPLAST A/S

Inventor： SUND, Anders Grove ,  STROEBECH, Esben ,  LANGHORN, Philip Holler ,  SLETTEN, Carsten ,  HOEJSTROEM, Michael

IPC: A61F5/445

Abstract: An adhesive wafer for an ostomy device, the wafer comprising a first adhesive layer, a backing layer on the distal side of the first adhesive layer, a second skin facing adhesive layer and a hole for accommodating a stoma. Embedded between the adhesive layers is a release layer capable of releasing a neutralizing compound to the peristomal skin.

公开(公告)号：EP3582726A2

公开(公告)日：2019-12-25

申请号：EP18707235.0

申请日：2018-02-20

Applicant: Coloplast A/S

Inventor： SUND, Anders Grove ,  STROEBECH, Esben ,  LANGHORN, Philip Holler ,  SLETTEN, Carsten ,  HOEJSTROEM, Michael

IPC: A61F5/445