System and method for polishing the edge of an electronic device

    公开(公告)号:US12202092B1

    公开(公告)日:2025-01-21

    申请号:US18668321

    申请日:2024-05-20

    Abstract: A system for polishing the edge of a mobile device is shown and described. The system includes a robot arm which is configured to grab a mobile device. The robot arm is configured to position the mobile device against at least one polishing wheel of a polishing device using a desired force. The system further includes the use of at least one polishing compound. In some instances, the at least one polishing compound is automatically applied to the at least one polishing wheel. In many of these instances the polishing compound is applied at a specific force and for a specific amount of time, ensuring only a desired amount of compound is applied. The system is contained within a chamber having at least one door configured to allow access to the interior of the chamber.

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