公开(公告)号：US11919115B2

公开(公告)日：2024-03-05

申请号：US17921480

申请日：2021-10-13

Applicant: DALIAN UNIVERSITY OF TECHNOLOGY

Inventor： Yuwen Sun ,  Shuyang Yan ,  Shutao Qi ,  Jinting Xu

IPC: B23Q3/06 ,  B23B25/06 ,  B23Q3/08

CPC classification number: B23Q3/065 ,  B23B25/06 ,  B23Q3/084

Abstract: The present invention discloses a flexible dot matrix bonding apparatus and an adaptive clamping method for a disk-type planar component. The apparatus mainly comprises three components: a substrate, connecting rods and an auxiliary support. The threaded holes in a circumferential array are uniformly distributed in the substrate, and the connecting rods are fixed at different circumferential positions of the substrate in a threaded connection manner, which play a role in bonding and supporting the disk-type planar component. The auxiliary support is matched with the substrate, so that a workpiece after turning can be taken out without damage. According to detection results of machining deformation of the disk-type planar component, the installation positions of the connecting rods on the substrate are adjusted accordingly, thus changing bonding positions of the disk-type planar component. Finally, an adaptive clamping method aiming at reducing the machining deformation of the disk-type planar component is formed.