METHOD FOR BONDING TWO SOLIDS TO EACH OTHER AND STRUCTURAL MATERIAL

    公开(公告)号:JPH11335631A

    公开(公告)日:1999-12-07

    申请号:JP12276899

    申请日:1999-04-28

    Applicant: DEGUSSA

    Abstract: PROBLEM TO BE SOLVED: To provide a method for bonding solids using covalent bond in relatively low temperature by bringing organosilicon compound unimolecular layers applied on the surface of two solids into contact with each other. SOLUTION: This method comprises applying unimolecular layers of an organosilicon compound of the formula (R is methyl, ethyl or propyl; X is 1, 2, 3 or 4; Y is 2-6) [preferably bis(alkoxysilylpropyl)disulfane] on the respective surfaces of two solids and, thereafter, bringing the solids into contact with each other so as to bond their almost smooth surface of the solids. The solids to be bonded preferably have hydrophilic surfaces. The compound of the formula is preferably used in gas phase and deposited on the surfaces so as to form the unimolecular layers. The compound of the formula is preferably used as a solution having >0-10 mol/L concentration. This method can be used for a composite structural material for microelectronics and micromechanics.

    2.
    发明专利
    未知

    公开(公告)号:DE19818962A1

    公开(公告)日:1999-11-04

    申请号:DE19818962

    申请日:1998-04-28

    Applicant: DEGUSSA

    Abstract: Bonding smooth surfaces of 2 solids together using organo-silicon compound comprises providing both surfaces with a mono-molecular film of a bis(trialkoxysilyl)alkyldi- to hexa-sulfane (I) and bringing the surfaces together. Bonding the smooth surface of 2 solids together using organo-silicon compounds comprises providing both surfaces with a mono-molecular film of a bis(trialkoxysilyl)alkyl di- to hexa-sulfane of formula (I) and bringing the surfaces together. Sy((CH2)xSi(OR)3)2 (I) R = methyl, ethyl or propyl x = 1 - 4 y = 2 - 6 An Independent claim is also included for a composite structure comprising 2 solids bonded in this way.

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