公开(公告)号：EP3109222A4

公开(公告)日：2017-08-30

申请号：EP15752710

申请日：2015-02-20

Applicant: DENKA COMPANY LTD

Inventor： AONO RYOTA ,  WADA KOSUKE ,  TSUICHIHARA MASAO ,  MIYAKAWA TAKESHI

IPC: C04B37/02 ,  B23K35/02 ,  B23K35/30 ,  H01L23/13 ,  H01L23/15 ,  H01L23/36 ,  H01L23/373 ,  H01L23/498 ,  H05K1/03 ,  H05K3/38

CPC classification number: H01L23/3735 ,  B23K35/0222 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/3006 ,  C04B37/02 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/60 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/49866 ,  H01L23/49877 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/388 ,  H01L2924/00

Abstract: [Problem] To obtain a ceramic circuit substrate having high bonding strength, excellent heat cycle resistance, enhanced reliability of operation as an electronic device, and excellent heat dissipation properties. [Solution] A ceramic circuit substrate in which metal plates and both main surfaces of a ceramic substrate are bonded via silver-copper brazing material layers, the ceramic circuit substrate characterized in that the silver-copper brazing material layers are formed from a silver-copper brazing material including 0.3-7.5 parts by mass of carbon fibers and 1.0-9.0 parts by mass of at least one active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium, and tin with respect to 75-98 parts by mass of silver powder and 2-25 parts by mass of copper powder totaling 100 parts by mass, with the carbon fibers having an average length of 15-400 µm, an average diameter of 5-25 µm, and an average aspect ratio of 3-28.

Abstract translation: [问题]为了获得具有高接合强度，优异的耐热循环性，提高作为电子设备的操作可靠性以及优异的散热性的陶瓷电路基板。 一种陶瓷电路基板，其特征在于，金属板与陶瓷基板的两主面经由银铜钎料层而接合，所述陶瓷电路基板的特征在于，所述银铜钎焊料层由银铜 包含0.3〜7.5质量份的碳纤维和1.0〜9.0质量份的选自钛，锆，铪，铌，钽，钒和锡中的至少一种活性金属的钎焊材料相对于75〜98质量份 的银粉和2〜25质量份的铜粉合计100质量份，碳纤维的平均长度为15〜400μm，平均直径为5〜25μm，平均纵横比为3〜 28。