公开(公告)号：US11765844B2

公开(公告)日：2023-09-19

申请号：US17733312

申请日：2022-04-29

Applicant: DENSO CORPORATION

Inventor： Hideki Miyabayashi ,  Kenji Ochi ,  Kazuma Kawai

IPC: H05K5/00 ,  H05K9/00 ,  H02M3/00

CPC classification number: H05K5/0069 ,  H05K9/0024 ,  H02M3/003

Abstract: A power conversion device, as an electronic device, includes a circuit substrate, a metal housing, an external connection terminal, and an insulator. The external connection terminal projects from the interior to the exterior of the metal housing, and is used to connect an output terminal of the circuit substrate to the exterior. A part of the insulator is disposed between the metal housing and the external connection terminal, and insulates the metal housing and the external connection terminal from one another. A housing extension portion is formed in the metal housing, extending from a body portion of the metal housing, in the inward direction with respect to the metal housing, in a condition facing the external connection terminal. A part of the insulator is disposed between the external connection terminal and the housing extension portion.

公开(公告)号：US10057985B2

公开(公告)日：2018-08-21

申请号：US15617082

申请日：2017-06-08

Applicant: DENSO CORPORATION

Inventor： Kenji Ochi

IPC: H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K5/00

CPC classification number: H05K1/092 ,  H05K1/09 ,  H05K1/111 ,  H05K1/181 ,  H05K3/4007 ,  H05K5/0069 ,  H05K2201/0338 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10636

Abstract: A printed substrate includes a land that is to be soldered. The land includes a plating film that defines a surface of the land. The plating film includes a metal as a main constituent and a pi-acceptor molecule that is dispersed in the plating film. The pi-acceptor molecule has pi-acceptability and causes ligand field splitting equal to or greater than that of 2,2′-bipyridyl in spectrochemical series. A content of the pi-acceptor molecule in the plating film is equal to or greater than 0.1 weight percent, in terms of carbon atoms, with respect to the metal of the plating film.

公开(公告)号：US09970121B2

公开(公告)日：2018-05-15

申请号：US14982048

申请日：2015-12-29

Applicant: DENSO CORPORATION

Inventor： Kenji Ochi ,  Toshihiro Miyake ,  Yasuo Ishihara

IPC: C25D9/02 ,  C25D3/12 ,  C25D3/22 ,  C25D3/38 ,  C25D3/56 ,  C25D5/00 ,  C25D7/00 ,  C25D15/00 ,  H01R13/03

CPC classification number: C25D9/02 ,  C25D3/12 ,  C25D3/22 ,  C25D3/38 ,  C25D3/56 ,  C25D5/00 ,  C25D7/00 ,  C25D15/00 ,  H01R13/03

Abstract: A composite material includes a metal material having conductivity and an oxidation inhibitor mixed with the metal material. The oxidation inhibitor forms a complex with the metal material to exert a resistance to oxidation of the metal material. For example, the composite material is formed on a surface of a base material as a plating material. As another example, the composite material is plated on a surface of an electrode.

公开(公告)号：US10403990B2

公开(公告)日：2019-09-03

申请号：US16114470

申请日：2018-08-28

Applicant: DENSO CORPORATION

Inventor： Kenji Ochi ,  Takumi Shiomi

IPC: H01R12/00 ,  H01R12/58 ,  H01R43/16 ,  H01R13/03

Abstract: A press-fit terminal is configured to exert a reaction force through elastic deformation on a through-hole and to be supported by the board, and includes two beams to be opposite to each other and to be elastically deformable. The two beams respectively have counter surfaces facing to each other. Each beam includes: a base material with a main surface and a side surface having one or more rounded corners formed in a curved surface with a contact zone in contact with the wall surface of the through-hole; and a plated film having a main portion on the main surface and an extension portion having an average thickness smaller than an average thickness of the main portion. The two beams have two or more of the rounded corners in total, and at least one of the rounded corners are provided with the extension portion.

公开(公告)号：US10727614B2

公开(公告)日：2020-07-28

申请号：US16274577

申请日：2019-02-13

Applicant: DENSO CORPORATION

Inventor： Kenji Ochi

IPC: H01R13/58 ,  H01R4/2433 ,  H01R4/2437 ,  H01R13/405 ,  H01R13/11

Abstract: A terminal holder unit of a wire connecting device includes a terminal accommodation space and a holder-side groove penetrating a wall of a holder base portion of the terminal holder unit in a wire extending direction. A covered electric wire is inserted into the holder-side groove. A press-insert terminal is inserted into the holder-side groove in a terminal insertion direction. A part of an insulating coating portion of the wire is removed, when cutting portions of the press-insert terminal are press-contacted to the wire. A part of a conductive wire portion of the wire is exposed to an outside of the wire, so that the press-insert terminal is electrically connected to the wire. A pair of wire stopper portions is formed in the holder base portion at both sides of the holder-side groove for limiting a movement of the wire in a direction from a wire assembled position to an open end of the holder-side groove.

公开(公告)号：US10027048B2

公开(公告)日：2018-07-17

申请号：US15617083

申请日：2017-06-08

Applicant: DENSO CORPORATION

Inventor： Kenji Ochi

IPC: H05K1/09 ,  H01R13/03 ,  H01R12/58

Abstract: An electrical component includes a connection portion that is to be in contact with other electrical component and is to establish an electrical connection with the other electrical component. The connection portion includes a plating film that defines a surface of the connection portion. The plating film includes a metal as a main constituent and an aromatic compound that is dispersed in the plating film. The aromatic compound has pi-acceptability and causes ligand field splitting equal to or greater than that of 2,2′-bipyridyl in spectrochemical series. A content of the aromatic compound in the plating film is equal to or greater than 0.1 weight percent, in terms of carbon atoms, with respect to the metal of the plating film.