公开(公告)号：US10681844B2

公开(公告)日：2020-06-09

申请号：US16386065

申请日：2019-04-16

Applicant: DISH Technologies L.L.C.

Inventor： Svitlana Trygubova ,  Morgan Kirby

IPC: H05K7/20 ,  H05K1/02

Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.

公开(公告)号：US20190246522A1

公开(公告)日：2019-08-08

申请号：US16386065

申请日：2019-04-16

Applicant: DISH Technologies L.L.C.

Inventor： Svitlana Trygubova ,  Morgan Kirby

IPC: H05K7/20 ,  H05K1/02

Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.

公开(公告)号：US11812584B2

公开(公告)日：2023-11-07

申请号：US16896616

申请日：2020-06-09

Applicant: DISH TECHNOLOGIES L.L.C.

Inventor： Svitlana Trygubova

IPC: H05K7/20 ,  F28F9/00 ,  F28F3/00 ,  H05K5/00

CPC classification number: H05K7/2049 ,  F28F3/00 ,  F28F9/002 ,  H05K5/0004

Abstract: A device for transferring heat from a device component to an environment includes a heat plate connected to a spring. A first fastener attaches the spring to the heat plate at a first location. A second fastener, such as a rivet, attaches the spring to the heat plate at each of a second and a third location. The second fastener includes a tab on and extending above the heat plate and corresponding tab slot on the spring. The spring is riveted to the heat plate at the first location and a second spring member accepts the tab at each of the second location and the third location. Ribs on a top surface of spring facilitate thermal coupling of the spring to the component when the device is assembled. One or more spring curvatures facilitate vertical deflection and horizontal extension of the spring during device assembly.

公开(公告)号：US20200305304A1

公开(公告)日：2020-09-24

申请号：US16896616

申请日：2020-06-09

Applicant: DISH TECHNOLOGIES L.L.C.

Inventor： Svitlana Trygubova

IPC: H05K7/20 ,  F28F9/00 ,  F28F3/00 ,  H05K5/00

Abstract: A device for transferring heat from a device component to an environment includes a heat plate connected to a spring. A first fastener attaches the spring to the heat plate at a first location. A second fastener, such as a rivet, attaches the spring to the heat plate at each of a second and a third location. The second fastener includes a tab on and extending above the heat plate and corresponding tab slot on the spring. The spring is riveted to the heat plate at the first location and a second spring member accepts the tab at each of the second location and the third location. Ribs on a top surface of spring facilitate thermal coupling of the spring to the component when the device is assembled. One or more spring curvatures facilitate vertical deflection and horizontal extension of the spring during device assembly.

公开(公告)号：US10356948B2

公开(公告)日：2019-07-16

申请号：US14986065

申请日：2015-12-31

Applicant: DISH Technologies L.L.C.

Inventor： Svitlana Trygubova ,  Morgan Kirby

IPC: H05K7/20 ,  H05K1/02

Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.