COATING FILM FOR ELECTRONIC DEVICE

    公开(公告)号:JPH10130532A

    公开(公告)日:1998-05-19

    申请号:JP27167397

    申请日:1997-10-03

    Applicant: DOW CORNING

    Abstract: PROBLEM TO BE SOLVED: To enable to obtain a temper proof coating film excellent in abrasion resistance, adhesivity and toughness and useful for electronic devices, etc., by coating a substrate with a specific coating composition and subsequently heating the coated substrate at a specific temperature. SOLUTION: This coating film is obtained by coating (A) a substrate such as an electronic device (concretely a silicon device, an optical electronic device, a photovoltanic cell, etc.) with (B) a coating composition comprising (B1 ) a preceramic material such as a silicon oxide precursor [e.g. a hydrogen silsesquioxane resin, a (partial) hydrolyzate of a compound of the formula: R n Si(OR )4-n (R is a 1-20C aliphatic, alicyclic or aromatic substituent; (n) is 0-3)], (B2 ) a flux material such as B2 O3 , PBO2 or P2 O5 , if necessary, (B3 ) a filler such as an inorganic filler and (B4 ) a solvent, and subsequently heating the coated substrate at a temperature (usually 50-1000 deg.C) sufficient to evaporate the component B4 , melt the component B2 and convert the component B1 into the ceramic coating film.

    METHOD FOR FORMING PROTECTIVE FILM ON ELECTRONIC DEVICE

    公开(公告)号:JPH10107024A

    公开(公告)日:1998-04-24

    申请号:JP14760297

    申请日:1997-06-05

    Applicant: DOW CORNING

    Abstract: PROBLEM TO BE SOLVED: To provide a mullilayered film which can be used for hermetic protection and can enhance protection of an electronic device against illegal probing, inspection or invasion. SOLUTION: Hydrogenated silses quioxane resin (H resin) is first applied to a surface of an electronic device, and then the resin is heated to be converted to a ceramic layer containing silica. Then a silicon carbide film is formed on the first film by a chemical vapor deposition(CVD) process. Next, a third ceramic layer containing impermeable or opaque porous silica is formed on the silicon carbide film, the H resin is applied thereto and then heated to be converted to ceramic containing porous silica. Impregnated into the third layer containing porous silica is impermeable material or material containing a filling agent. A fourth layer is made of metal or alloy. Next, The fourth layer is covered with substantially the same fifth layer as the third ceramic layer containing opaque porous silica. However, the composition of the fifth opaque layer is preferably different from that of the third opaque layer.

    ELECTRONIC COATING COMPOSITION
    6.
    发明专利

    公开(公告)号:JPH1017383A

    公开(公告)日:1998-01-20

    申请号:JP2708097

    申请日:1997-02-10

    Applicant: DOW CORNING

    Abstract: PROBLEM TO BE SOLVED: To obtain a coating compsn. as a stable soln. capable of deposing a coating film having superior quality and an unexpected thickness on an electronic device by incorporating specified linear siloxane as a carrier fluid for a precursor of Si-contg. ceramic. SOLUTION: This coating compsn. contains 1-50wt.% precursor of Si-contg. ceramic and 50-99wt.% linear siloxane represented by the formula, R3 -(SiR2 -O)-R3 [where each of R1 -R3 is H, 1-6C alkyl, alkenyl or aryl and (n) is 1-6]. A coating film obtd. from this coating compsn. has high quality (e.g. purity and dielectric constant) and the desired thickness. Since this coating compsn. has a long shelf life even at room temp. and contains a small amt. of a volatile org. component, it has satisfactory fitness for a storage vessel and does not adversely affect the environment.

    10.
    发明专利
    未知

    公开(公告)号:DE69413195T2

    公开(公告)日:1999-05-06

    申请号:DE69413195

    申请日:1994-12-20

    Applicant: DOW CORNING

    Abstract: This invention relates to integrated circuits which are protected from the environment. Such circuits are sealed by applying a non-corroding metal layer (4) to the bond pads (2) and a passivation layer (5) to the remainder of the circuit.

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