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公开(公告)号：JPH11323135A
公开(公告)日：1999-11-26
申请号：JP7505299
申请日：1999-03-19
Applicant: DOW CORNING
Inventor： FECHT CASSANDRE M , PETERSON ADAM LEE , SMITH JANET M , URRUTIA-GUTIERREZ ADRIANA , KOSAL JEFFREY ALAN
Abstract: PROBLEM TO BE SOLVED: To provide a microemulsion stable even in the presence of a salt. SOLUTION: This composition contains (A) a silicone component being an oil-in-water aqueous microemulsion containing a polysiloxane stabilized with a cationic surfactant in the microemulsion and (B) an inorganic salt and an organic salt. The polysiloxane in the cationic microemulsion has a particle size of 100 nm or below, desirably, 40 nm or below. The polysiloxane is desirably a polydimethylsiloxane or an amine-functional polysiloxane prepared by emulsion polymerization. It is desirable that the composition contains at least 20 wt.% salt.
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公开(公告)号：AU4912190A
公开(公告)日：1990-08-16
申请号：AU4912190
申请日：1990-02-07
Applicant: DOW CORNING
Inventor： PETERSON ADAM LEE
Abstract: The combination of known thermally conductive fillers having an average particle size of from about 10 to about 100 microns with aluminum nitride having an average particle size of less than one micron improves the thermal conductivity of organosiloxane compositions. The thermal conductivity values achieved using this combination of fillers is higher than can be achieved using the maximum loading of either filler alone that can be present without adversely affecting the ability of the organosiloxane composition to cure or to serve as useful coatings and encapsulants for electronic solid state devices and other substrates.
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公开(公告)号：DE69918583D1
公开(公告)日：2004-08-19
申请号：DE69918583
申请日：1999-03-18
Applicant: DOW CORNING
Inventor： FECHT CASSANDRE M , PETERSON ADAM LEE , SMITH JANET MARY , URRUTIA-GUTIERREZ ADRIANA , KOSAL JEFFREY ALAN
Abstract: A composition is disclosed that contains (A) a silicone component which is an aqueous oil-in-water microemulsion containing a polysiloxane stabilized in the microemulsion by a cationic surfactant, and (B) an inorganic salt or an organic salt. The polysiloxane in the cationic microemulsion has a particle diameter of less than 100 nanometer, preferably less than 40 nanometer. The polysiloxane is a polydimethylsiloxane or an amine functional polysiloxane, preferably prepared by emulsion polymerization. The composition preferably contains at least twenty percent by weight of the salt.
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公开(公告)号：DE69010227T2
公开(公告)日：1994-11-24
申请号：DE69010227
申请日：1990-02-07
Applicant: DOW CORNING
Inventor： PETERSON ADAM LEE
Abstract: The combination of known thermally conductive fillers having an average particle size of from about 10 to about 100 microns with aluminum nitride having an average particle size of less than one micron improves the thermal conductivity of organosiloxane compositions. The thermal conductivity values achieved using this combination of fillers is higher than can be achieved using the maximum loading of either filler alone that can be present without adversely affecting the ability of the organosiloxane composition to cure or to serve as useful coatings and encapsulants for electronic solid state devices and other substrates.
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Patent Agency Ranking
公开(公告)号：DE69918583T2
公开(公告)日：2005-07-21
申请号：DE69918583
申请日：1999-03-18
Applicant: DOW CORNING
Inventor： FECHT CASSANDRE M , PETERSON ADAM LEE , SMITH JANET MARY , URRUTIA-GUTIERREZ ADRIANA , KOSAL JEFFREY ALAN
Abstract: A composition is disclosed that contains (A) a silicone component which is an aqueous oil-in-water microemulsion containing a polysiloxane stabilized in the microemulsion by a cationic surfactant, and (B) an inorganic salt or an organic salt. The polysiloxane in the cationic microemulsion has a particle diameter of less than 100 nanometer, preferably less than 40 nanometer. The polysiloxane is a polydimethylsiloxane or an amine functional polysiloxane, preferably prepared by emulsion polymerization. The composition preferably contains at least twenty percent by weight of the salt.
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公开(公告)号：SG89277A1
公开(公告)日：2002-06-18
申请号：SG1999001367
申请日：1999-03-13
Applicant: DOW CORNING
Inventor： FECHT CASSANDRE M , PETERSON ADAM LEE , SMITH JANET MARY , GUTIERREZ ADRIANA URRUTIA , KOSAL JEFFREY ALAN
Abstract: A composition is disclosed that contains (A) a silicone component which is an aqueous oil-in-water microemulsion containing a polysiloxane stabilized in the microemulsion by a cationic surfactant, and (B) an inorganic salt or an organic salt. The polysiloxane in the cationic microemulsion has a particle diameter of less than 100 nanometer, preferably less than 40 nanometer. The polysiloxane is a polydimethylsiloxane or an amine functional polysiloxane, preferably prepared by emulsion polymerization. The composition preferably contains at least twenty percent by weight of the salt.
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公开(公告)号：BR9902342A
公开(公告)日：2000-03-21
申请号：BR9902342
申请日：1999-03-19
Applicant: DOW CORNING
Inventor： FECHT CASSANDRE M , PETERSON ADAM LEE , SMITH JANET MARY , GUTIERREZ ADRIANA URRUTIA , KOSAL JEFFREY ALAN
Abstract: A composition is disclosed that contains (A) a silicone component which is an aqueous oil-in-water microemulsion containing a polysiloxane stabilized in the microemulsion by a cationic surfactant, and (B) an inorganic salt or an organic salt. The polysiloxane in the cationic microemulsion has a particle diameter of less than 100 nanometer, preferably less than 40 nanometer. The polysiloxane is a polydimethylsiloxane or an amine functional polysiloxane, preferably prepared by emulsion polymerization. The composition preferably contains at least twenty percent by weight of the salt.
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公开(公告)号：CA2266161A1
公开(公告)日：1999-09-20
申请号：CA2266161
申请日：1999-03-18
Applicant: DOW CORNING
Inventor： KOSAL JEFFREY ALAN , FECHT CASSANDRE MICHELLE , PETERSON ADAM LEE , SMITH JANET MARY , GUTIERREZ ADRIANA URRUTIA
Abstract: A composition is disclosed that contains (A) a silicone component which is an aqueous oil-in-water microemulsion containing a polysiloxane stabilized in the microemulsion by a cationic surfactant, and (B) an inorganic salt or an organic salt. The polysiloxane in the cationic microemulsion has a particle diameter of less than 100 nanometer, preferably less than 40 nanometer. The polysiloxane is a polydimethylsiloxane or an amine functional polysiloxane, preferably prepared by emulsion polymerization. The composition preferably contains at least twenty percent by weight of the salt.
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公开(公告)号：DE69010227D1
公开(公告)日：1994-08-04
申请号：DE69010227
申请日：1990-02-07
Applicant: DOW CORNING
Inventor： PETERSON ADAM LEE
Abstract: The combination of known thermally conductive fillers having an average particle size of from about 10 to about 100 microns with aluminum nitride having an average particle size of less than one micron improves the thermal conductivity of organosiloxane compositions. The thermal conductivity values achieved using this combination of fillers is higher than can be achieved using the maximum loading of either filler alone that can be present without adversely affecting the ability of the organosiloxane composition to cure or to serve as useful coatings and encapsulants for electronic solid state devices and other substrates.
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