公开(公告)号：AT405602T

公开(公告)日：2008-09-15

申请号：AT03789983

申请日：2003-11-24

Applicant: DOW GLOBAL TECHNOLOGIES INC ,  IBM

Inventor： HEDRICK JEFFREY ,  SANKARAPANDIAN MUTHUMANICKAM ,  TYBERG CHRISTY ,  GODSCHALX JAMES ,  NIU QING ,  SILVIS H

IPC: C08G61/00 ,  C08G61/10 ,  C08L65/00 ,  C09D165/00 ,  H01L23/532

Abstract: A crosslinked polyarylene material with a reduced coefficient of thermal expansion at high temperatures compared with conventional crosslinked polyarylene materials is provided. In addition, an integrated circuit article containing a crosslinked polyarylene polymer with reduced coefficient of thermal expansion at high temperatures is provided.