公开(公告)号：WO1996038026A1

公开(公告)日：1996-11-28

申请号：PCT/US1996007478

申请日：1996-05-22

Applicant: DYNACO CORPORATION

Inventor： DYNACO CORPORATION ,  FLAMMER, Jeffrey ,  GERRIE, Richard ,  GRIFFITH, Russel

IPC: H05K01/02

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/0041 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: Single and multilayer circuit boards (10) are provided which boards (10) have rigid portions (16) and at least one flexible portion (18). The method involves the use of printed circuit techniques to fabricate the board (10) with flexibility being obtained by windowing interconnect layers (22) for the boards (10) and for at least one embodiment, some but not all of the substrates (12) in the flexible area (18). Where only interconnect layers (22) are provided, at least one, but not all, of such layers (22) are windowed in the flexible area (18). A flexible encapsulant (30) is preferably provided over any portion of a substrate (12) having circuitry thereon at least in the flexible portion (18) thereof. A composite material having aramid fibres encapsulated in a resin is utilized for substrates (12) and interconnecting layers (22) for embodiments where large numbers of flexures may be required and/or where high temperature stability is required. Enhanced performance with changes in temperature is also achieved by having all layers formed of substantially the same material and having all circuit bearing layers of substantially the same thickness. Sequential layering may also be provided to enhance flexibility.

Abstract translation: 提供单层和多层电路板（10），其中板（10）具有刚性部分（16）和至少一个柔性部分（18）。 该方法涉及使用印刷电路技术来制造板（10），其灵活性是通过对用于板（10）的互连层（22）进行加窗而获得的，并且对于至少一个实施例，一些但不是全部的基板（12） 在柔性区域（18）中。 在仅提供互连层（22）的情况下，这些层（22）中的至少一个而不是全部在柔性区域（18）中被窗口化。 优选地，至少在其柔性部分（18）中，在其上具有电路的基底（12）的任何部分上提供柔性密封剂（30）。 对于可能需要大量挠曲和/或需要高温稳定性的实施例，将具有包封在树脂中的芳族聚酰胺纤维的复合材料用于基底（12）和互连层（22）。 通过使所有层由基本上相同的材料形成并且具有基本上相同厚度的所有电路轴承层，也可实现具有温度变化的增强性能。 也可以提供顺序分层以增强灵活性。