FOLDABLE ELECTRONIC ASSEMBLY MODULE
    1.
    发明申请
    FOLDABLE ELECTRONIC ASSEMBLY MODULE 审中-公开
    可折叠电子装配模块

    公开(公告)号:WO1998020714A1

    公开(公告)日:1998-05-14

    申请号:PCT/US1997020018

    申请日:1997-11-06

    Applicant: DYNAMEM, INC.

    Abstract: A foldable electronic assembly (10') is provided with extending ears (44) for protecting folded substrates (22) in flexible areas and with elements between adjacent face-to-face boards (18, 20) to maintain selected spacing between the boards while mechanically holding adjacent boards together. Elements (46) may also be provided in the area of the ears which are adapted to coact with a suitable tool to facilitate removal of the assembly from a mating connector.

    Abstract translation: 可折叠电子组件(10')设置有延伸的耳朵(44),用于在柔性区域中保护折叠的基板(22),并且在相邻的面对面板(18,20)之间保持选定的间隔,同时 将相邻板机械地夹在一起。 也可以在耳朵的区域中设置元件(46),所述区域适于与合适的工具共同作用以便于从配合连接器移除组件。

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