公开(公告)号：EP1734578B1

公开(公告)日：2008-07-09

申请号：EP06076155.8

申请日：2006-06-02

Applicant: Delphi Technologies, Inc.

Inventor： Brandenberg, Scott D. ,  Chengalva, Suresh K.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1734578A1

公开(公告)日：2006-12-20

申请号：EP06076155.8

申请日：2006-06-02

Applicant: Delphi Technologies, Inc.

Inventor： Brandenberg, Scott D. ,  Chengalva, Suresh K.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.

Abstract translation: 冷却的电子组件包括集成电路器件载体（例如印刷电路板），器件（例如倒装芯片），液体泵，成型材料，热交换器和盖。 该装置和液体泵电连接到集成电路装置载体。 模制材料被模制到装置，液体泵和集成电路装置载体上。 盖具有流体地连接到热交换器的冷却剂通道，其中盖附接到模制材料。 冷却剂通道和热交换器一起至少部分地限定了封闭的冷却剂回路。 液体泵可操作地连接到封闭的冷却剂回路。 一种用于冷却印刷电路板的方法包括将液体冷却剂放置在封闭的冷却剂回路中并通过印刷电路板电激活液体泵。