公开(公告)号：EP1628345B1

公开(公告)日：2017-01-18

申请号：EP05076743.3

申请日：2005-07-28

Applicant: Delphi Technologies, Inc.

Inventor： Brandenbrug, Scott D. ,  Chengalva, Suresh K. ,  Degenkolb, Thomas A.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube (22) directly coupled to one or more semiconductor chips (12, 14, 16), with the encapsulant (34) being molded over the semiconductor chips (12, 14, 16) and portions of the cooling tube (22) in proximity to the semiconductor chips (12, 14, 16). The encapsulant (34) immobilizes the cooling tube (22) with respect to the semiconductor chips (12, 14, 16), and the cooling tube (22) and encapsulant (34) are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips (12, 14, 16).

公开(公告)号：EP1628345A3

公开(公告)日：2006-03-29

申请号：EP05076743.3

申请日：2005-07-28

Applicant: Delphi Technologies, Inc.

Inventor： Brandenbrug, Scott D. ,  Chengalva, Suresh K. ,  Degenkolb, Thomas A.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube (22) directly coupled to one or more semiconductor chips (12, 14, 16), with the encapsulant (34) being molded over the semiconductor chips (12, 14, 16) and portions of the cooling tube (22) in proximity to the semiconductor chips (12, 14, 16). The encapsulant (34) immobilizes the cooling tube (22) with respect to the semiconductor chips (12, 14, 16), and the cooling tube (22) and encapsulant (34) are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips (12, 14, 16).

Abstract translation: 封装的微电子封装包括直接耦合到一个或多个半导体芯片（12,14,16）的流体导电冷却管（22），其中密封剂（34）模制在半导体芯片（12,14,16）上，部分 靠近半导体芯片（12,14,16）的冷却管（22）。 密封剂（34）相对于半导体芯片（12,14,16）固定冷却管（22），并且冷却管（22）和密封剂（34）被设计成使其热膨胀系数相对较小 到半导体芯片（12,14,16）。

公开(公告)号：EP1628345A2

公开(公告)日：2006-02-22

申请号：EP05076743.3

申请日：2005-07-28

Applicant: Delphi Technologies, Inc.

Inventor： Brandenbrug, Scott D. ,  Chengalva, Suresh K. ,  Degenkolb, Thomas A.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube (22) directly coupled to one or more semiconductor chips (12, 14, 16), with the encapsulant (34) being molded over the semiconductor chips (12, 14, 16) and portions of the cooling tube (22) in proximity to the semiconductor chips (12, 14, 16). The encapsulant (34) immobilizes the cooling tube (22) with respect to the semiconductor chips (12, 14, 16), and the cooling tube (22) and encapsulant (34) are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips (12, 14, 16).

Abstract translation: 封装的微电子封装包括直接耦合到一个或多个半导体芯片（12,14,16）的流体导电冷却管（22），其中密封剂（34）模制在半导体芯片（12,14,16）上，部分 靠近半导体芯片（12,14,16）的冷却管（22）。 密封剂（34）相对于半导体芯片（12,14,16）固定冷却管（22），并且冷却管（22）和密封剂（34）被设计成使其热膨胀系数相对较小 到半导体芯片（12,14,16）。