公开(公告)号：EP1609838A2

公开(公告)日：2005-12-28

申请号：EP05076406.7

申请日：2005-06-16

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Chaudhuri. Arun K.

IPC: C09K5/06 ,  C09K5/14 ,  H01L23/373

CPC classification number: H01L23/4275 ,  C09K5/063 ,  C09K5/14 ,  H01L23/3737 ,  H01L2924/0002 ,  Y02P20/13 ,  Y10T428/25 ,  H01L2924/00

Abstract: The present invention provides a high performance polymer-base material (10, 20, 30) capable of dissipating transient thermal energy generated by an electronic module, such as a heat-generating power device. The methods of the present invention involve adding a suitable thinner to reduce the viscosity and increase the volume of a polymer-base matrix material (12) so that a large amount of thermal absorbing particles (14, 22, 25) may be added. The final cured product may have a filler content of more than 80 weight %. Further, the present invention provides a new and reduced cost formulation of a polymer-base thermal transient suppression material (30) containing organic wax particles.

Abstract translation: 本发明提供一种能够消散由诸如发热功率器件的电子模块产生的瞬态热能的高性能聚合物基材料（10,20,30）。 本发明的方法包括加入合适的稀释剂以降低聚合物基质基体材料（12）的粘度和增加体积，从而可以加入大量的热吸收颗粒（14,22,25）。 最终的固化产物可以具有大于80重量％的填料含量。 此外，本发明提供了含有有机蜡颗粒的聚合物基热瞬变抑制材料（30）的新的和降低的成本制剂。

公开(公告)号：EP1609838A3

公开(公告)日：2010-09-29

申请号：EP05076406.7

申请日：2005-06-16

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Chaudhuri. Arun K.

IPC: C09K5/06 ,  C09K5/14 ,  H01L23/373

CPC classification number: H01L23/4275 ,  C09K5/063 ,  C09K5/14 ,  H01L23/3737 ,  H01L2924/0002 ,  Y02P20/13 ,  Y10T428/25 ,  H01L2924/00

Abstract: The present invention provides a high performance polymer-base material (10, 20, 30) capable of dissipating transient thermal energy generated by an electronic module, such as a heat-generating power device. The methods of the present invention involve adding a suitable thinner to reduce the viscosity and increase the volume of a polymer-base matrix material (12) so that a large amount of thermal absorbing particles (14, 22, 25) may be added. The final cured product may have a filler content of more than 80 weight %. Further, the present invention provides a new and reduced cost formulation of a polymer-base thermal transient suppression material (30) containing organic wax particles.